期刊信息
期刊名称：《中国胶粘剂》CHINA ADHESIVES
创办日期：1986(1973)
主管部门：上海华谊（集团）有限公司
主办单位：上海市合成树脂研究所有限公司、中国胶粘剂和胶粘带工业协会
刊 期：月刊
Email：GXLJ@chinajournal.net.cn
国内统一刊号(CN)：
CN 31-1601/TQ
国际标准刊号(ISSN)：
ISSN 1004-2849
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本刊介绍
《中国胶粘剂》为重点报道中国胶粘剂科研成果和最新进展的学术期刊，月刊。1973年创刊，原名为《树脂粘合剂》，1979年更名为《粘合剂》，1991年更名为《中国胶粘剂》，2014年12月，成为原国家新闻出版广电总局第一批认定学术期刊。
主管单位是上海华谊控股集团有限公司，主办单位是上海市合成树脂研究所有限公司、中国胶粘剂和胶粘带工业协会。
期刊在国内外公开发行，国内发行代号为4-454，国外发行代号为M5121；国内统一连续出版物号为CN31-1601/TQ，国际标准连续出版物号为ISSN 1004-2849。
期刊设有专题综述、研究报告、工艺与应用、材料科学等栏目，主要报道国内外胶粘剂、密封剂和胶粘带行业的最新理论研究成果、原料/设备/制备工艺创新、粘接接头设计制备技术、生产应用实践等论文和综述等，主要涉及领域主要包括化工、轻工、包装、纺织、建筑、机械、电子、航空、航天、汽车、船舶、林木、家具和印刷等领域。
期刊为中国科技核心期刊、RCCSE中国核心学术期刊，《科技期刊世界影响力指数（WJCI）报告》收录期刊，曾为全国中文核心期刊（2007/2011/2014/2017年），现被“中国核心期刊数据库、”“中国期刊全文数据库”、“中国学术期刊综合评价数据库”、《中国学术期刊影响因子年报》统计源、美国《化学文摘》（CA）、中国知网数据库（CNKI）、万方数据库、维普数据库、新华网“学术中国”以及长江文库等收录，先后荣获《CAJ-CD规范》执行优秀期刊、全国石油和化工行业优秀期刊二等奖、全国石油和化工行业优秀期刊一等奖、华东地区优秀期刊奖、上海市科技期刊审读优秀奖、上海市期刊编校质量优秀奖、全国石油和化工学术期刊50强、全国石油和化工行业期刊100强、全国石油和化工学术期刊60强。2024年，期刊还被中国化工学会发布的首版《化工领域高质量科技期刊分级目录》入选为T3级期刊，标志着我刊已进入化工领域“国内外重要、为学术界所认可的期刊”队列。2024年期刊复合影响因子为1.595，综合影响因子为1.309。
《中国胶粘剂》杂志是胶粘剂行业的窗口，是胶粘剂企业的桥梁，是胶粘剂读者的纽带。
环氧树脂增韧改性技术研究进展
Research progress on toughening modification technologies of epoxy resin
傅雨祺; Fu Yuqi;针对环氧树脂交联密度大、脆性高、抗裂纹萌生与扩展能力弱等缺陷，本文系统梳理了近年来环氧树脂增韧改性技术的研究进展，为兼顾高韧性与综合性能的材料设计提供参考。从分子结构设计与能量耗散机制出发，将现有增韧技术归纳为9类：液体橡胶增韧、核壳颗粒增韧、热致液晶聚合物增韧、热塑性树脂增韧、互穿/半互穿网络结构增韧、超支化聚合物增韧、化学结构改性增韧、柔性链固化剂增韧及动态配位键增韧，并分类阐述其作用机理、工艺特点及对材料性能的影响。环氧树脂增韧改性的核心在于构建多重能量耗散路径，未来需依托分子模拟实现增韧剂结构定制化，融合多技术协同策略，并开发工艺简化、生物基的绿色增韧体系，以突破增韧效果、力学性能与加工成本难以协同优化的产业化瓶颈。
To address the defects of epoxy resin such as high crosslinking density,high brittleness,and weak resistance to crack initiation and propagation,the research progress on toughening modification technologies of epoxy resin in recent years was systematically summarized in this paper,providing reference for material design that balanced high toughness and comprehensive properties. Starting from molecular structure design and energy dissipation mechanisms,the existing toughening technologies were categorized into nine types:liquid rubber toughening,core-shell particle toughening,thermotropic liquid-crystalline polymer toughening,thermoplastic resin toughening,interpenetrating/semi-interpenetrating polymer network structure toughening,hyperbranched polymer toughening,chemical structure modification toughening,flexible-chain curing agent toughening,and dynamic coordination bond toughening.Their action mechanisms,process characteristics,and effects on material properties were elaborated for each category. The core of epoxy resin toughening modification lay in constructing multiple energy dissipation pathways. Future efforts needed to rely on molecular simulation to achieve structural customization of toughening agents,integrate multi-technology synergistic strategies,and develop green toughening systems with simplified processes and bio-based materials,in order to break through the industrialization bottleneck where toughening effects,mechanical properties,and processing costs were difficult to optimize synergistically.
功能型蛋白胶粘剂最新研究进展
Recent developments in functional protein adhesive
陈珊;欧阳光华;石亮;万如意;章瑜;钟雪琴;郑保昌;陈海龙; Chen Shan;Ouyang Guanghua;Shi Liang;Wan Ruyi;Zhang Yu;Zhong Xueqin;Zheng Baochang;Chen Hailong;随着不可再生资源过度开发与环境污染加剧，合成树脂胶粘剂的健康与环境隐患日益凸显，蛋白胶粘剂因绿色可再生、功能多样成为研究热点。本文系统综述了功能型蛋白胶粘剂最新研究进展，并按来源梳理植物蛋白（大豆、小麦、玉米醇溶蛋白等）、动物蛋白（明胶、胶原、蛛丝蛋白等）及废弃蛋白资源。重点阐述了耐水、高韧、防霉、阻燃、导电/电磁屏蔽、荧光、生物相容及其他特殊功能（导热、自修复、智能响应）型蛋白胶粘剂的改性策略与性能机制，涵盖共价/多重交联、纳米增强、基因工程融合蛋白等路径。最后指出当前产业化面临原料种类有限、成本高、专用设备缺乏、批次性能波动等困境，提出人工智能可辅助蛋白结构筛选、配方预测、改性控制与工艺优化，为功能型蛋白胶粘剂创新开发提供理论参考。
The excessive exploitation of non-renewable resources and aggravated environmental pollution highlight the growing health and environmental hazards of synthetic resin adhesive,and protein adhesive has emerged as a research hotspot owing to their green,renewable nature and versatile functionalities. The latest research progress on functional protein adhesive was systematically summarized in this paper,and the protein sources were classified into plant proteins(soybean,wheat,zein,etc.),animal proteins(gelatin,collagen,spider silk protein,etc.),and waste protein resources. The modification strategies and performance mechanisms of protein adhesive with water resistance,high toughness,mold resistance,flame retardancy,conductivity/electromagneticshielding,fluorescence,biocompatibility,and other special functions(thermal conductivity,self-healing,and intelligent response) were elaborated,which covered covalent and multiple crosslinking,nano-enhancement,and genetically engineered fusion-protein approaches.Finally,it was pointed out that the current industrialization was facing difficulties such as limited types of raw materials,high costs,lack of specialized equipment,and fluctuations in batch performance.It was proposed that artificial intelligence could assist in protein structure screening,formula prediction,modification control,and process optimization,providing theoretical reference for the innovative development of functional protein adhesive.
高强玻璃纤维及其复合材料的研究应用进展
Research and application progress of high-strength glass fiber and its composites
李亚锋 ;张杜鹃 ;鹿海军 ; Li Yafeng ;Zhang Dujuan ;Lu Haijun ;高强玻璃纤维是先进树脂基复合材料的重要特种增强纤维，在航空、航天、兵器、舰船与电子等领域应用广泛。为系统反映其最新研究进展，对国内外高强玻璃纤维、织物及其复合材料的发展与应用现状进行了综述。目前，美国S-2、法国R、日本T、俄罗斯BMΠ及中国HS等系列高强玻璃纤维均已实现规模化生产，纤维浸胶纱线的拉伸强度普遍超过3 000 MPa，拉伸模量达84～96 GPa。高强玻璃纤维织物通过浸润剂改性及后处理工艺显著提升了与树脂基体的界面结合性能。高强玻璃纤维增强热固性树脂/热塑性树脂基复合材料兼具优异的力学性能、抗冲击性、耐疲劳性和透波性，已成功应用于防弹装甲、直升机桨叶、雷达罩等关键部件。未来，高强玻璃纤维及其复合材料将朝着高性能化、高模量化、织物后处理工艺以及热塑性复合材料回收利用等方向发展。
High-strength glass fiber is an important specialty reinforcing fiber for advanced resin-matrix composites and is widely applied in aviation,aerospace,ordnance,warships,and electronics. To systematically reflect its latest research progress,the development and application status of high-strength glass fibers,fabrics,and their composites at home and abroad were reviewed. At present,series of high-strength glass fibers including American S-2,French R,Japanese T,Russian BMΠ,and Chinese HS,had all achieved large-scale production.The tensile strength of fiber-impregnated roving generally exceeded 3 000 MPa,and the tensile modulus reached 84-96 GPa. High-strength glass fiber fabrics significantly improved the interfacial bonding performance with resin matrices through sizing agent modification and post-treatment processes. High-strength glass fiber reinforced thermosetting resin/thermoplastic resin-matrix composites combined excellent mechanical properties,impact resistance,fatigue resistance,and wave-transmitting capability,and were successfully applied in ballistic armor,helicopter rotor blades,radomes,and other critical components.In the future,the development of high-strength glass fibers and their composites was projected to move toward high performance,high modulus,fabric post-treatment processes,and recycling of thermoplastic composites.
导电胶在不同粘接界面的可靠性研究
Reliability research of conductive adhesive at different bonding interfaces
崔志远;刘钊;朱舒燕;金泽珠;刘昊;赵丁伟; Cui Zhiyuan;Liu Zhao;Zhu Shuyan;Jin Zezhu;Liu Hao;Zhao Dingwei;导电胶在电子封装领域中扮演着重要角色，其性能直接影响到器件的可靠性和使用寿命。针对电子封装中导电胶在异质界面互联的可靠性评价需求，为揭示环境应力与界面材料匹配性对导电胶服役性能的影响规律，本研究以HD-908型低应力环氧导电胶为对象。选取硅基芯片/可伐合金镀金基板、陶瓷片/铝合金镀金基板、陶瓷电容/陶瓷基板三类典型界面组合。按GJB 548C—2021标准开展150℃/1 000 h高温老化与200次温度冲击试验，测试导电胶的芯片剪切强度与体积电阻率，并结合SEM、DSC表征微观结构与热行为。研究结果表明：高温老化后体积电阻率由2.0×10-4Ω·cm降至0.4×10-4Ω·cm，硅基芯片与陶瓷片的剪切强度分别提升5.49%和13.28%，陶瓷电容下降19.18%。温度冲击试验过程中，体积电阻率先大幅降低后小幅升高，芯片剪切强度的变化与互联材料之间的热膨胀系数差异有关，互联材料之间的热膨胀系数差异越大，芯片剪切强度衰减越严重。衰减幅度从小到大依次为：硅基芯片/可伐合金镀金基板<陶瓷电容/陶瓷基板<陶瓷片/铝合金镀金基板。本研究通过系统分析导电胶在不同界面组合下的性能变化，揭示了环境和材料因素对导电胶可靠性的影响规律，对电子封装领域中工艺优化和互联材料的选用具有一定的指导意义。
Conductive adhesive plays an important role in the field of electronic packaging,and its performance directly affects the reliability and service life of devices. To address the reliability evaluation requirement for conductive adhesive interconnection at heterogeneous interfaces in electronic packaging,and to reveal the influence of environmental stress and interface material compatibility on the service performance of conductive adhesive,HD-908 low-stress epoxy conductive adhesive was selected as the research object in this study.Three typical interface combinations,namely silicon chip/Kovar alloy substrate,ceramic chip/aluminum alloy,and ceramic capacitor/ceramic substrate were selected.High-temperature aging tests at 150 ℃ for 1 000 h and 200-cycle temperature shock tests were conducted according to GJB 548C—2021 standard.The chip shear strength and volume resistivity of conductive adhesive were tested,and the microstructure and thermal behavior were characterized by SEM and DSC. The research results showed that after high-temperature aging,the volume resistivity decreased from 2.0×10-4 Ω·cm to 0.4×10-4 Ω·cm.The chip shear strength of silicon chip and ceramic chip increased by 5.49% and 13.28%,respectively,while that of caramic capacitor decreased by 19.18%.During the temperature shock tests,the volume resistivity first decreased sharply and then increased slightly.The change in chip shear strength was related to the difference in coefficient of thermal expansion between the interconnected materials. The greater the coefficients of thermal expansion mismatch between the interconnected materials,the more severe the attenuation of chip shear strength. The attenuation magnitude increased in the following order:silicon chip/Kovar alloy substrate < ceramic capacitor/ceramic substrate < ceramic chip/aluminum alloy.This study systematically analyzed the performance change of conductive adhesive under different interface combinations and revealed the influence of environmental and material factors on the reliability of conductive adhesive.These findings provided certain guidance for the process optimization and the selection of interconnection materials in the field of electronic packaging.
空天领域耐高温糊状胶粘剂的可靠性应用研究
Reliability and application research of high-temperature resistant paste adhesive in aerospace field
景君怡;穆雪峰;孙明明;邢文旭;刘彩召; Jing Junyi;Mu Xuefeng;Sun Mingming;Xing Wenxu;Liu Caizhao;AVIC Chengdu Aircraft Design and Research Institute;随着空天技术的飞速发展，对结构胶粘剂的性能要求日益提高。针对空天飞行器服役环境对结构胶粘剂耐高温性能与工艺适应性的严苛需求，本文开展国产80℃固化型耐高温糊状环氧胶粘剂的可靠性应用研究，为其工程化推广提供数据支撑。首先分析了高性能糊状环氧胶粘剂的固化行为及热稳定性，重点考察了工艺参数（包括放置时间、胶层厚度、表面处理方式）对其粘接性能的影响。评估了其对不同复合材料的粘接匹配性，并深入探究了其耐环境老化（湿热、介质、盐雾）与热老化性能。研究结果表明：该胶粘剂起始固化温度为74℃，氮气氛围下5%热失重温度达325℃，230℃下仍保持16.3 MPa的剪切强度。其对室温停放时间表现出一定工艺宽容度，但胶层厚度增加会导致内应力增大与缺陷增多，致使强度下降，且表面处理质量对界面性能起决定性作用。该胶粘剂与ZT9H/2401型、ZT9H/1316型复合材料均实现基材破坏，耐湿热（70℃水浸14 d）后高温剪切强度保持率达82.6%以上，耐航空煤油与盐雾性能优异。总之，该胶粘剂兼具优异的耐高温性、工艺适应性与环境可靠性，具备在我国新一代航空装备结构中工程化应用的潜力。本研究也为高性能糊状胶粘剂在飞行器结构中的工程化应用提供了一定的数据支撑和理论依据。
With the rapid development of aerospace technology,the performance requirements for structural adhesive increase continuously.To meet the stringent demands of the service environment of aerospace vehicles for high-temperature resistance and process adaptability of structural adhesive,the reliability and application research on the domestically produced 80 ℃ curing high-temperature resistant paste epoxy adhesive was conducted in this study,providing data support for its engineering promotion.First,the curing behavior and thermal stability of highperformance paste epoxy adhesive were analyzed.The effects of process parameters(including storage time,adhesive layer thickness,and surface treatment method) on its bonding performance were investigated. Its bonding compatibility with different composite materials was evaluated,and its environmental aging resistance(damp heat,medium,salt spray) and thermal aging performance were thoroughly investigated.The research results showed that,the initial curing temperature of adhesive was 74 ℃,the 5% weight-loss temperature reached 325 ℃ under nitrogen atmosphere,the shear strength still remained at 16.3 MPa at 230 ℃.The adhesive exhibited a certain degree of process tolerance to room-temperature storage time.However,increased adhesive layer thickness led to increased internal stress and more defects,resulting in decreased strength.Moreover,the quality of surface treatment played a decisive role in interfacial performance.The adhesive achieved substrate failure with both ZT9H/2401 and ZT9H/1316 composite materials.The high-temperature shear strength retention rate reached over 82.6% after damp heat resistance testing(immersion in water at 70 ℃ for 14 d).The resistance to aeronautical kerosene and salt spray was excellent.In conclusion,this adhesive possessed excellent high-temperature resistance,process adaptability,and environmental reliability,and had the potential for engineering application in the structures of new-generation aeronautical equipment in China. This study also provided certain data support and theoretical basis for the engineering application of high-performance paste adhesive in aircraft structures.
聚烯丙基芳砜醚酮的制备及其环氧胶粘剂应用
Preparation of polyallylarylsulfone ether ketone and its application in epoxy adhesive
胡思雨;虞鑫海;张玉环;颜亚轩;王怡然;赵欣洋; Hu Siyu;Yu Xinhai;Zhang Yuhuan;Yan Yaxuan;Wang Yiran;Zhao Xinyang;针对环氧树脂胶粘剂韧性不足、耐热性与介电性能难以协同提升的问题，本研究以4,4′-二氟二苯甲酮和3,3′-二烯丙基双酚S为原料，经亲核取代缩聚反应合成聚烯丙基芳砜醚酮(PAEK)。将其与双酚A型环氧树脂、酸酐固化体系复配，引入过氧化二苯甲酰引发烯丙基交联，制备了PAEK/环氧胶粘剂系列(E-1～E-5)。对其结构和性能进行表征，此外还基于Kissinger与Crane方程分析了其固化动力学。研究结果表明：(1)PAEK的收率在99%以上，玻璃化转变温度为162℃，具备优异的耐热性。(2)适量PAEK的引入实现了环氧胶粘剂体系的增强与增韧的协同提升。当PAEK添加量为10%(E-4)时，胶粘剂的综合力学性能相对最优：120℃高温下拉伸剪切强度仍保持12.2 MPa，冲击强度达22.3 kJ/m2，弯曲强度达106.4 MPa。(3)对典型配方E-3的固化动力学进行分析，计算得到活化能(Ea)为68.31 kJ/mol，反应级数(n)为0.9。(4)PAEK的引入有效降低了体系极性基团密度，使胶粘剂在100 kHz频率下介电损耗稳定在1.04%～1.12%区间，电容值为4.39～5.25 pF，表现出优异的介电稳定性。同时，致密的交联网络使各配方吸水率均低于0.4%，具备良好的疏水性与电绝缘性能。(5)该PAEK/环氧胶粘剂在保持环氧体系优异粘接性能的基础上，同步提升了耐热性、韧性与介电性能，在高频高速电子封装、航空航天绝缘结构粘接等领域具有重要的应用潜力。
To address the problems of insufficient toughness of epoxy adhesive and the difficulty in simultaneously improving heat resistance and dielectric properties,4, 4′-difluorobenzophenone and 3,3′-diallylbisphenol S were employed as raw materials,and polyallylarylsulfone ether ketone(PAEK) was synthesized via nucleophilic substitution polycondensation.It was then blended with bisphenol A epoxy resin and an anhydride curing system.Benzoyl peroxide was introduced to initiate allyl crosslinking,and PAEK/epoxy adhesive series(E1-E5) were finally prepared. Their structures and properties were characterized,in addition,the curing kinetics were analyzed based on the Kissinger and Crane equations.The research results showed that,(1) The yield of PAEK was over 99%,the glass transition temperature was 162 ℃,demonstrating it had excellent heat resistance.(2) The introduction of an appropriate amount of PAEK had achieved a synergistic improvement in the reinforcement and toughening of epoxy adhesive system.When the addition amount of PAEK was 10%(E-4),the comprehensive mechanical properties of the adhesive were relatively optimal:the tensile shear strength remained at 12.2 MPa at high temperature of 120 ℃,the impact strength reached 22.3 kJ/m2,and the flexural strength reached 106.4 MPa.(3) The curing kinetics of typical formula E-3 were analyzed,and the activation energy(Ea) was calculated to be 68.31 kJ/mol,with the reaction order(n) of 0.9.(4) The introduction of PAEK effectively reduced the density of polar groups in the system,stabilizing the dielectric loss of the adhesive in the range of 1.04%-1.12% at a frequency of 100 kHz,with the capacitance value of 4.39～5.25 pF,exhibiting excellent dielectric stability.At the same time,the dense cross-linked network resulted in the water absorption rate of less than 0.4% for all formulations,possessing good hydrophobicity and electrical insulation properties.(5) This PAEK/epoxy adhesive not only maintained excellent bonding performance of epoxy system,but also simultaneously improved heat resistance,toughness,and dielectric properties.It had important application potential in high-frequency and highspeed electronic packaging,aerospace insulation structure bonding,and other fields.
