中国胶粘剂

导电胶在电子封装领域中扮演着重要角色，其性能直接影响到器件的可靠性和使用寿命。针对电子封装中导电胶在异质界面互联的可靠性评价需求，为揭示环境应力与界面材料匹配性对导电胶服役性能的影响规律，本研究以HD-908型低应力环氧导电胶为对象。选取硅基芯片/可伐合金镀金基板、陶瓷片/铝合金镀金基板、陶瓷电容/陶瓷基板三类典型界面组合。按GJB 548C—2021标准开展150℃/1 000 h高温老化与200次温度冲击试验，测试导电胶的芯片剪切强度与体积电阻率，并结合SEM、DSC表征微观结构与热行为。研究结果表明：高温老化后体积电阻率由2.0×10^-4Ω·cm降至0.4×10^-4Ω·cm，硅基芯片与陶瓷片的剪切强度分别提升5.49%和13.28%，陶瓷电容下降19.18%。温度冲击试验过程中，体积电阻率先大幅降低后小幅升高，芯片剪切强度的变化与互联材料之间的热膨胀系数差异有关，互联材料之间的热膨胀系数差异越大，芯片剪切强度衰减越严重。衰减幅度从小到大依次为：硅基芯片/可伐合金镀金基板<陶瓷电容/陶瓷基板<陶瓷片/铝合金镀金基板。本研究通过系统分析导电胶在不同界面组合下的性能变化，揭示了环境和材料因素对导电胶可靠性的影响规律，对电子封装领域中工艺优化和互联材料的选用具有一定的指导意义。

Conductive adhesive plays an important role in the field of electronic packaging,and its performance directly affects the reliability and service life of devices. To address the reliability evaluation requirement for conductive adhesive interconnection at heterogeneous interfaces in electronic packaging,and to reveal the influence of environmental stress and interface material compatibility on the service performance of conductive adhesive,HD-908 low-stress epoxy conductive adhesive was selected as the research object in this study.Three typical interface combinations,namely silicon chip/Kovar alloy substrate,ceramic chip/aluminum alloy,and ceramic capacitor/ceramic substrate were selected.High-temperature aging tests at 150 ℃ for 1 000 h and 200-cycle temperature shock tests were conducted according to GJB 548C—2021 standard.The chip shear strength and volume resistivity of conductive adhesive were tested,and the microstructure and thermal behavior were characterized by SEM and DSC. The research results showed that after high-temperature aging,the volume resistivity decreased from 2.0×10^-4 Ω·cm to 0.4×10^-4 Ω·cm.The chip shear strength of silicon chip and ceramic chip increased by 5.49% and 13.28%,respectively,while that of caramic capacitor decreased by 19.18%.During the temperature shock tests,the volume resistivity first decreased sharply and then increased slightly.The change in chip shear strength was related to the difference in coefficient of thermal expansion between the interconnected materials. The greater the coefficients of thermal expansion mismatch between the interconnected materials,the more severe the attenuation of chip shear strength. The attenuation magnitude increased in the following order:silicon chip/Kovar alloy substrate < ceramic capacitor/ceramic substrate < ceramic chip/aluminum alloy.This study systematically analyzed the performance change of conductive adhesive under different interface combinations and revealed the influence of environmental and material factors on the reliability of conductive adhesive.These findings provided certain guidance for the process optimization and the selection of interconnection materials in the field of electronic packaging.