
期刊信息
期刊名称:《中国胶粘剂》CHINA ADHESIVES
创办日期:1986(1973)
主管部门:上海华谊(集团)有限公司
主办单位:上海市合成树脂研究所有限公司、中国胶粘剂和胶粘带工业协会
刊 期:月刊
电 话:010-87663098/87663304
Email:GXLJ@chinajournal.net.cn
国内统一刊号(CN):
CN 31-1601/TQ
国际标准刊号(ISSN):
ISSN 1004-2849
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本刊介绍
《中国胶粘剂》为重点报道中国胶粘剂科研成果和最新进展的学术期刊,月刊。1973年创刊,原名为《树脂粘合剂》,1979年更名为《粘合剂》,1991年更名为《中国胶粘剂》,2014年12月,成为原国家新闻出版广电总局第一批认定学术期刊。
主管单位是上海华谊控股集团有限公司,主办单位是上海市合成树脂研究所有限公司、中国胶粘剂和胶粘带工业协会。
期刊在国内外公开发行,国内发行代号为4-454,国外发行代号为M5121;国内统一连续出版物号为CN31-1601/TQ,国际标准连续出版物号为ISSN 1004-2849。
期刊设有专题综述、研究报告、工艺与应用、材料科学等栏目,主要报道国内外胶粘剂、密封剂和胶粘带行业的最新理论研究成果、原料/设备/制备工艺创新、粘接接头设计制备技术、生产应用实践等论文和综述等,主要涉及领域主要包括化工、轻工、包装、纺织、建筑、机械、电子、航空、航天、汽车、船舶、林木、家具和印刷等领域。
期刊为中国科技核心期刊、RCCSE中国核心学术期刊,《科技期刊世界影响力指数(WJCI)报告》收录期刊,曾为全国中文核心期刊(2007/2011/2014/2017年),现被“中国核心期刊数据库、”“中国期刊全文数据库”、“中国学术期刊综合评价数据库”、《中国学术期刊影响因子年报》统计源、美国《化学文摘》(CA)、中国知网数据库(CNKI)、万方数据库、维普数据库、新华网“学术中国”以及长江文库等收录,先后荣获《CAJ-CD规范》执行优秀期刊、全国石油和化工行业优秀期刊二等奖、全国石油和化工行业优秀期刊一等奖、华东地区优秀期刊奖、上海市科技期刊审读优秀奖、上海市期刊编校质量优秀奖、全国石油和化工学术期刊50强、全国石油和化工行业期刊100强、全国石油和化工学术期刊60强。2024年,期刊还被中国化工学会发布的首版《化工领域高质量科技期刊分级目录》入选为T3级期刊,标志着我刊已进入化工领域“国内外重要、为学术界所认可的期刊”队列。2024年期刊复合影响因子为1.595,综合影响因子为1.309。
《中国胶粘剂》杂志是胶粘剂行业的窗口,是胶粘剂企业的桥梁,是胶粘剂读者的纽带。
中国胶粘剂和胶粘带行业现状及发展趋势
Status and development trend of China adhesive and tape industry
杨栩; Yang Xu;基于最新的行业统计数据和产业政策,从行业市场概况、经济运行特点、行业面临的问题与挑战,以及行业发展前景展望四个维度,系统分析并全面阐述中国胶粘剂和胶粘带行业的现状与发展动向。
Based on the updated industry statistics and policies,the current situation and development trends of China's adhesive and tape industry were analyzed systematically and elaborated comprehensively in this article from four aspects of industry market overview,economic operation characteristics,problems and challenges faced by the industry,and industry development prospects.
汽车内饰用改性水性聚氨酯胶粘剂的研究进展
Research progress of modified waterborne polyurethane adhesive for automotive interior
范秀明;金鑫;姜辉;姜虹宇; Fan Xiuming;Jin Xin;Jiang Hui;Jiang Hongyu;本文系统阐述了汽车内饰领域聚氨酯(PU)胶粘剂及水性聚氨酯(WPU)胶粘剂的基本概况与制备方法,重点围绕WPU胶粘剂的主流改性研究展开综述。通过详细分析环氧树脂、有机硅、有机氟及纳米材料等多元改性方法对WPU胶粘剂的作用机制,深入探讨了改性产物的结构特征与性能演变规律。在此基础上对WPU胶粘剂的未来发展趋势进行了展望。
The basic overview and preparation methods of polyurethane(PU) adhesive and waterborne polyurethane(WPU) adhesive in the automotive interior field were elaborated systematically in this article,with a focus on the mainstream modification research of WPU adhesive.By analyzing in details the action mechanism of various modification methods such as epoxy resin,silicone,organic fluorine,and nanomaterials on WPU adhesive,the structural characteristics and performance evolution of the modified products were deeply explored.On this basis,the future development trend of WPU adhesive was discussed.
LED响应的光产碱体系制备及在巯基-环氧胶粘剂中的应用研究
Preparation of LED-responsive photo alkali production system and its application in thiol-epoxy adhesive
朱伟特;李治全;刘晓暄; Zhu Weite;Li Zhiquan;Liu Xiaoxuan;针对目前光产碱剂吸收波长短,难以与LED光源匹配的问题,本文以还原态脒(PL-DBN)为光产碱剂,分别与异丙基硫杂蒽酮(ITX)、2-乙基蒽醌(2-EAQ)和9,10-二丁氧基蒽(DBA)三种光敏剂复配,制备了一类LED响应的光产碱体系,并系统研究了其在巯基-环氧胶粘剂中的应用。研究结果表明:(1)PL-DBN/2-EAQ体系具有最小的电子转移吉布斯自由能(-3.227 eV),光敏化效率最高;(2)在365 nm LED辐照下,PL-DBN/2-EAQ体系的pH可从7.65快速升至11.08,表明其具有优异的产碱效率;(3)随光照时间延长(0~15 min),巯基-环氧聚合起始温度可从80.3℃降至56.2℃,表明光产碱体系有效降低了反应能垒。(4)巯基和环氧官能团转化率最终可达95%和100%;光照15 min的样品在60℃放置1 h可完全固化,粘接强度达3.5 MPa,显示出其在精密粘接领域(如柔性电子封装、光学器件组装等)的良好应用前景。
In response to the problem of short absorption wavelength and difficulty in matching with LED light sources,reduced amidine(PL-DBN) was used as a photo alkali generator in this paper,and combined it with three photosensitizers,namely isopropylthioanthraquinone(ITX),2-ethylanthraquinone(2-EAQ),and 9,10-dibutoxyanthracene(DBA),a type of LED-responsive photo alkali system was prepared,and its application in thiol-epoxy adhesive was studied systematically. The research results showed that,(1) The PL-DBN/2-EAQ system had the smallest electron transfer Gibbs free energy(-3.227 eV) and the highest photosensitization efficiency.(2) Under 365 nm LED irradiation,the pH of PL-DBN/2-EAQ system could rapidly increase from 7.65 to 11.08,indicating its excellent alkali production efficiency.(3) With the extension of light exposure time(0-15 min),the starting temperature of thiol-epoxy polymerization could be reduced from 80.3 ℃ to 56.2 ℃,indicating that the photo alkali production system effectively reduced the reaction energy barrier.(4) The conversion rates of thiol and epoxy functional groups could ultimately reach 95% and 100%,respectively. The sample exposed to light for 15 minutes could be completely cured after being placed at 60 ℃ for 1 hour,with a bonding strength of 3.5 MPa,demonstrating its promising application prospects in precision bonding fields such as flexible electronic packaging and optical device assembly.
新型mAP-E多官能环氧胶粘剂的研制与性能研究
Research on development and performance of novel mAP-E multi-functional epoxy adhesive
张翼;虞鑫海; Zhang Yi;Yu Xinhai;为突破传统四官能团环氧树脂四缩水甘油基二氨基二苯甲烷(TGDDM)黏度高、韧性差的技术瓶颈,本文以间氨基苯酚环氧树脂(mAP-E)为基体,通过调控其与TGDDM的共混比例,构建了JmAP系列环氧胶粘剂体系。系统研究了该胶粘剂体系的工艺性能、耐热特性和力学性能等关键指标。研究结果表明:(1)mAP-E体系能够显著降低TGDDM的黏度,所制备的JmAP胶粘剂具有较低的黏度,从而表现出良好的工艺性能。(2)通过分析胶粘剂的玻璃化转变温度(Tg),在JmAP系列胶粘剂中,TGDDM含量增加使Tg值向高温区移动,JmAP-5的玻璃化转变温度(Tg=164.7℃)较JmAP-0提高了16.3%,证明TGDDM的引入显著改善了环氧胶粘剂体系的耐热性能。(3)通过分析力学性能,JmAP系列胶粘剂随着TGDDM比例的增加,在不同温度下的各项力学性能都有不同程度的提升。其中,JmAP-5在高温下的综合力学性能相对较为突出,各温度下的拉伸剪切性能优良。在宽温域拉伸剪切性能测试中,JmAP-5也表现出最佳综合性能。(4)吸水性能分析表明,在JmAP系列胶粘剂体系中,各配方胶粘剂的吸水率均未超过0.5%,展现出优异的耐久性和使用寿命。(5)电学性能分析表明,JmAP系列胶粘剂的电容稳定性良好,波动范围在0.15 pF以内,相对介电常数相差不超过0.15,介电损耗在2%以下。其中JmAP-5的电学性能最好,1 000 Hz下的电容为5.37~5.53 pF,介电损耗低于1.72%,相对介电常数在4.14~4.22之间。这说明JmAP-5配方有着优异的电学性能,可以适用于电子绝缘领域。
To overcome the technical bottleneck of high viscosity and poor toughness of traditional tetra functional group epoxy resin of tetraglycidyl diaminodiphenylmethane(TGDDM),a series of JmAP epoxy adhesive systems were established in this article by using m-aminophenol epoxy resin(mAP-E) as the matrix and adjusting its blending ratio with TGDDM.The key performance indicators such as the processability,thermal resistance,and mechanical properties of adhesive systems were investigated systematically.The research results showed that,(1) The mAP-E system could significantly reduce the viscosity of TGDDM,and the prepared JmAP adhesive had a lower viscosity,thus exhibiting good processability.(2) By analyzing the glass transition temperature(Tg) of the adhesive,it was found that in the JmAP series adhesive,the increase in TGDDM content caused the Tg value to shift towards higher temperatures.The glass transition temperature(Tg=164.7 ℃) of JmAP-5 increased by 16.3% compared to JmAP-0,demonstrating that the introduction of TGDDM significantly improved the heat resistance of the epoxy adhesive system.(3) By analyzing the mechanical properties,the JmAP series adhesive showed varying degrees of improvement in various mechanical properties at different temperatures with the increase of TGDDM ratio.Among them,JmAP-5 had relatively outstanding comprehensive mechanical properties at high temperature and excellent tensile shear properties at various temperatures. In the wide temperature range tensile shear performance test,JmAP-5 also showed the best comprehensive performance.(4) The analysis of water absorption performance showed that in the JmAP series adhesive system,the water absorption rate of each formula adhesive did not exceed 0.5%,demonstrating excellent durability and service life.(5) Electrical performance analysis showed that the JmAP series adhesive had good capacitance stability,with the fluctuation range within 0.15 pF,the relative dielectric constant difference of no more than 0.15,and the dielectric loss of less than 2%.Among them,JmAP-5 had the best electrical performance,with the capacitance of 5.37-5.53 pF at 1 000 Hz,the dielectric loss of less than 1.72%,and the relative dielectric constant between 4.14-4.22. This indicated that the JmAP-5 formulation had excellent electrical properties and could be applied in the field of electronic insulation.
耐高温含磷丙烯酸酯压敏胶的制备及黏弹性研究
Preparation and viscoelasticity study of high temperature resistance phosphorus-containing acrylate pressure sensitive adhesive
薛双乐;薛刚;张绪刚;孙明明;袁志刚;邢文旭;李坚辉;张斌; Xue Shuangle;Xue Gang;Zhang Xugang;Sun Mingming;Yuan Zhigang;Xing Wenxu;Li Jianhui;Zhang Bin;以2-羟乙基丙烯酸酯磷酸酯(HEMAP)与丙烯酸酯单体为原料,通过共聚反应制备丙烯酸酯磷酸酯压敏胶。重点研究了不同含量HEMAP对压敏胶粘接性能的影响及黏弹性行为。研究结果表明:(1)随着HEMAP含量的增加,1 220 cm-1的P=O双键伸缩振动峰越明显,压敏胶的玻璃化转变温度(Tg)也略微增加。(2)随着HEMAP含量的增加,压敏胶的初粘性呈现逐渐下降趋势,持粘时间及剥离强度增加,而且压敏胶的耐高温性能提升。(3)同一温度下压敏胶的储能模量(G')及损耗模量(G″)均随HEMAP含量增加而升高;在25~160℃的不同温度下,HEMAP含量增加,压敏胶的温度依赖性减弱,耐温性提升;HEMAP含量影响压敏胶的流变与粘接性能。(4)随着HEMAP含量的增加,压敏胶最大形变减小,恢复率升高,抗蠕变性增强。(5)扫描频率升高使压敏胶的G'和G″增加,而随着HEMAP含量的增加,聚合物链的缠结及交联密度进一步增加,链段松弛时间变短,导致压敏胶的G'及G″在不同频率范围内越来越高。PSA-P0.75具有较高的剥离强度,但其初粘性较差。
Using 2-hydroxyethyl acrylate phosphate(HEMAP) and acrylic monomer as raw materials,acrylate phosphate pressure sensitive adhesive was prepared by copolymerization reaction.The effects of different contents of HEMAP on the bonding performance and viscoelastic behavior of pressure sensitive adhesive were studied emphatically. The research results showed that,(1) As the content of HEMAP increased,the stretching vibration peak of the P=O double bond at 1 220 cm-1 became more pronounced,and the glass transition temperature(Tg) of pressure sensitive adhesive also slightly increased.(2) With the increase of HEMAP content,the initial tack of pressure sensitive adhesive gradually decreased,the holding time and peel strength increased,and the high temperature resistance of pressure sensitive adhesive improved.(3) The storage modulus(G') and loss modulus(G″) of pressure sensitive adhesive increased with the increase of HEMAP content at the same temperature.At different temperatures ranging from 25 to 160 ℃,with the increase of HEMAP content,the temperature dependence of pressure sensitive adhesive decreased,and the temperature resistance improved. The HEMAP content affected the rheological and bonding properties of pressure sensitive adhesive.(4) With the increase of HEMAP content,the maximum deformation of pressure sensitive adhesive decreased,the recovery rate increased,and the creep resistance was enhanced.(5) As the scanning frequency increased,the G' and G″ of pressure sensitive adhesive increased.However,with the increase of HEMAP content,the entanglement and cross-linking density of polymer chains further increased,and the relaxation time of chain segments became shorter,resulting in higher G' and G″ of pressure sensitive adhesive in different frequency ranges.PSA-P0.75 had high peel strength,but its initial tack was poor.
一种环氧胶膜对钛合金与复合材料的胶接研究
Research on bonding of titanium alloy and composite material with an epoxy adhesive film
杨海冬;王德志;李洪峰;肖万宝;赵立伟;冯浩;郑帅;曲春艳; Yang Haidong;Wang Dezhi;Li Hongfeng;Xiao Wanbao;Zhao Liwei;Feng Hao;Zheng Shuai;Qu Chunyan;本文采用环氧树脂、界面改性剂、增韧剂和固化剂为原料,采用熔融与机械共混的方法,制备了一种新型环氧胶膜,并对其固化工艺、耐热性能、微观形貌及力学性能进行了研究。研究结果表明:(1)通过DSC法对改性树脂的固化反应动力学进行了研究,通过线性拟合求得反应活化能Ea=68.17 kJ/mol和反应级数n=0.92,说明基体树脂固化反应为一个复杂的固化反应过程。(2)通过tanδ法测试该胶膜的玻璃化转变温度分别为194℃和223℃,胶膜具有良好的热机械性能。TG曲线表明固化后的胶膜质量损失5%的温度约为351℃,说明胶膜具有优异的耐高温特性。(3)23℃下,钛合金与复材及铝合金与铝合金的剪切强度均在40 MPa以上,相差较小;在121℃和177℃下,钛合金与复材的剪切强度明显低于铝合金与铝合金,因此高温条件下(121℃及177℃)钛合金与复材的胶接强度取决于复材的本体强度。(4)常温(23℃)及高温(177℃)测试条件下,两种固化工艺(150℃/3 h及180℃/3 h)下胶膜对钛合金与复材试片的剪切强度都很接近,破坏模式基本一致,表明胶膜在两种固化条件下实现了完全固化,达到同样的粘接效果。(5)该胶膜在航空发动机复合材料叶片领域具有一定的应用前景。
Using epoxy resin,interfacial modifier,toughening agent,and curing agent as raw materials,a new type of epoxy adhesive film was prepared in this paper by a combination of melting and mechanical blending methods. The curing process,heat resistance,micromorphology,and mechanical properties of the film were subsequently investigated.The research results showed that,(1) The curing reaction kinetics of the modified resin were investigated by using the DSC method.Through linear fitting,the reaction activation energy Ea was determined to be 68.17 kJ/mol and the reaction order n was 0.92,indicating that the curing reaction of the matrix resin was a complex curing process.(2) The glass transition temperatures of adhesive film were tested by using the tanδ method and found to be 194 ℃ and 223 ℃,respectively.The adhesive film exhibited excellent thermal and mechanical properties. The TG curve showed that the temperature at which the cured adhesive film lost 5% of its mass was approximately 351 ℃,indicating that the adhesive film had excellent high-temperature resistance.(3) At 23 ℃,the shear strength of titanium alloy and composite material,as well as aluminum alloy and aluminum alloy,were all above 40 MPa,with a small difference.At 121 ℃ and 177 ℃,the shear strength of titanium alloy and composite material was significantly lower than that of aluminum alloy and aluminum alloy.Therefore,the bonding strength of titanium alloy and composite material under high temperature conditions(121 ℃ and 177 ℃) depended on the bulk strength of the composite material.(4) Under the testing conditions of room temperature(23 ℃) and high temperature(177 ℃),the shear strength of adhesive film on titanium alloy and composite specimens was very close under two curing processes(150 ℃/3 h and 180 ℃/3 h),and the failure mode was basically the same,indicating that the adhesive film had achieved complete curing under both curing conditions and achieved the same bonding effect.(5) The adhesive film had certain application prospects in the field of composite blades for aircraft engines.