<正>《中国胶粘剂》主要报道有关胶粘剂和密封剂领域的科研、生产、应用、发展、市场、产品性能与分析鉴定、粘接技术、管理等文稿，包括专题与综述、论文、成果报告、信息交流和资料介绍等。与作者关于投稿方面的约定(1)来稿必须具有创新性、实用性、科学性、准确性、规范性和可读性。（2）论文必须附不涉及泄密项目、无一稿多投和基金项目（包括基金编号）的单位公章证明。
以二苯基甲烷二异氰酸酯（MDI）、聚醚多元醇和双酚A环氧树脂为原料，采用预聚体法，并通过1,4-丁二醇扩链，合成三种不同MDI比例的环氧嵌段聚氨酯。将所合成的环氧嵌段聚氨酯用于增韧双酚A型环氧树脂，系统研究其对改性树脂的粘接性能、力学性能、热性能、动态热机械性能及微观断裂形貌的影响。研究结果表明：合成的环氧嵌段聚氨酯与环氧树脂相容性良好，固化体系形成均相结构；随着MDI比例增加，体系玻璃化转变温度升高，且在150℃下具有良好热稳定性。微观形貌显示，中等MDI比例的样品在断裂面可形成纤维状结构与多重裂纹，有效促进塑性变形与能量耗散，显著提升材料韧性。力学性能测试表明，4-2#样品在添加量为30份时综合性能最优，常温剪切强度为34.67 MPa，剥离强度达4.02 N/mm。该研究证明，通过化学键合将环氧链段嵌入聚氨酯结构可实现界面强化与协同增韧，为高韧性、高模量环氧树脂复合材料的设计提供了有效途径。
Using diphenylmethane diisocyanate(MDI),polyether polyol,and bisphenol A epoxy resin as raw materials,three different MDI ratios of epoxy-blocked polyurethane were synthesized by the prepolymer method and chain extension with 1, 4-butanediol. The synthesized epoxy-blocked polyurethane was used to toughen bisphenol A-type epoxy resin,and its effects on the bonding properties,mechanical properties,thermal properties,dynamic thermomechanical properties,and micro fracture morphology of the modified resin were systematically studied.The research results showed that the synthesized epoxy-blocked polyurethane had good compatibility with epoxy resin,and the curing system formed a homogeneous structure.As the proportion of MDI increased,the glass transition temperature of the system rose and it exhibited good thermal stability at 150 ℃.Microscopic morphology showed that samples with moderate MDI ratios could form fibrous structures and multiple cracks at the fracture surface,effectively promoting plastic deformation and energy dissipation,and significantly improving material toughness. The mechanical performance test showed that sample 4-2# had the best comprehensive performance when the addition amount was 30 phr,with the room temperature shear strength of 34.67 MPa and the peel strength of 4.02 N/mm. This study demonstrated that embedding epoxy segments into polyurethane structures through chemical bonding could achieve interface strengthening and synergistic toughening,providing an effective approach for the design of high toughness and high modulus epoxy resin composites.
为提高含胺预聚物型热熔邻苯二甲腈树脂(PNA)的固化效率，探究磺胺胍对PNA固化行为的促进作用。本研究通过熔融共混法制备了不同磺胺胍含量(1～7份)的PNAS树脂体系，并对它们的放热行为进行分析，进一步探讨PNA和PNAS-5的固化动力学、热性能和粘接性能。研究结果表明：磺胺胍显著降低了PNA的固化温度与活化能，随其用量增加，固化放热峰由双峰逐渐合并为单峰；当磺胺胍用量为5份(PNAS-5)时，固化峰值温度由PNA的330℃降至260℃，主要固化温区从300℃以上移至230～300℃。动力学分析显示，PNAS-5的平均活化能为67.10 kJ/mol，较PNA(98.45 kJ/mol)降低约31.8%，且低转化率下活化能更低，更利于低温固化。在200℃/3 h+220℃/3 h固化条件下，PNAS-5的25℃拉伸剪切强度达18.2 MPa，较PNA提高61%。磺胺胍未损害体系的高热稳定性，PNA与PNAS-5的初始分解温度(T5%)分别为479与481℃，800℃残碳率均高于74%；但因磺胺胍柔性结构的引入，PNAS-5的玻璃化转变温度(Tg)降低42℃，致其高温粘接强度略有下降，体现了力学增强与热机械性能间的平衡。综合研究表明，磺胺胍可有效地促进含胺邻苯二甲腈树脂的低温高效固化，兼具优良热稳定性与常温粘接性能。
To improve the curing efficiency of hot melt prepolymeric phthalonitrile resin containing amine(PNA),the accelerating effect of sulfaguanidine on the curing behavior of PNA was investigated. PNAS resin systems with different sulfaguanidine contents(1-7 phr) by melt blending method were prepared in this study,and their exothermic behavior was analyzed to further explore the curing kinetics,thermal properties,and bonding properties of PNA and PNAS-5.The research results showed that sulfaguanidine significantly reduced the curing temperature and activation energy of PNA.As the dosage increased,the exothermic peak of curing gradually merged from double peaks to a single peak. When the dosage of sulfaguanidine was 5 phr(PNAS-5),the curing peak temperature decreased from 330 ℃ of PNA to 260 ℃,and the main curing temperature zone shifted from above 300 ℃ to 230-300 ℃.Dynamics analysis showed that the average activation energy of PNAS-5 was 67.10 kJ/mol,which was about 31.8% lower than that of PNA(98.45 kJ/mol),and the activation energy was lower at low conversion rates,which was more conducive to low-temperature curing.Under the curing condition of 200 ℃/3 h+220 ℃/3 h,the tensile shear strength of PNAS-5 at 25 ℃ reached 18.2 MPa,which was 61% higher than that of PNA.Sulfaguanidine did not damage the high thermal stability of the system.The initial decomposition temperatures(T5%) of PNA and PNAS-5 were 479 ℃ and 481 ℃,respectively,and the residual carbon rates at 800 ℃ were all higher than 74%. However,due to the introduction of sulfaguanidine flexible structure,the glass transition temperature(Tg) of PNAS-5 decreased by 42 ℃,resulting in a slight decrease in its high-temperature bonding strength,reflecting the balance between mechanical enhancement and thermomechanical properties.Comprehensive research had shown that sulfaguanidine could effectively promote the low-temperature and efficient curing of phthalonitrile resin containing amine,with excellent thermal stability and room temperature bonding properties.
本文基于中国胶粘剂和胶粘带工业协会对77家重点企业的调查统计，系统回顾了“十四五”时期（2021-2025年）中国热熔胶行业的发展状况，并展望了“十五五”期间（2026-2030年）的行业趋势与规划。研究显示，2025年中国热熔胶行业销售量达187.96万吨，销售额为323.22亿元，同比增长率分别为4.36%和1.07%，增速较前期明显放缓，表明行业已进入从高速规模扩张向高质量发展转型的关键阶段。产业结构方面，乙烯-醋酸乙烯共聚物（EVA）、苯乙烯-丁二烯-苯乙烯嵌段共聚物（SBS）、聚烯烃（PO）热熔胶等传统产品销量稳中有升，而反应型聚氨酯（PUR）热熔胶等高端品种增长显著，成为重要的结构性增长点。下游应用市场中，交通运输、包装、卫材等领域需求保持较好增长，建筑、木工等传统市场趋于稳定，光伏用热熔胶膜增长势头放缓。行业同时面临“内卷”式竞争加剧、企业盈利压力增大、经营环境复杂等挑战。展望“十五五”，中国热熔胶行业将以创新驱动与稳健发展为核心，着力推动产品高端化、绿色化、智能化与国际化，重点发展光伏胶膜（POE）、UV/EB固化压敏胶、反应型聚氨酯（PUR）热熔胶、生物基及可降解胶粘剂等关键技术，并规划到2030年实现总产量282.5万吨、销售额471.9亿元的发展目标。本文旨在为行业政策制定、企业战略调整及相关研究提供系统的市场数据与趋势参考。
Based on the survey statistics of 77 key enterprises conducted by the China Adhesives and Tape Industry Association,the development status of China's hot melt adhesive industry during the 14 th Five Year Plan period(2021-2025) was systematically reviewed in this paper,and the industry trends and plans for the 15 th Five Year Plan period(2026-2030) were forecasted.Research showed that in 2025,China's hot melt adhesive industry achieved a sales volume of 1.879 6 million tons and a sales value of 32.322 billion yuan,with year-on-year growth rates of 4.36% and 1.07% respectively. The growth rates significantly slowed compared to previous period,indicating the industry has entered a critical phase of transforming from high-speed scale expansion to high-quality development.In terms of industrial structure,traditional products such as ethylene-vinyl acetate copolymer(EVA),styrene-butadiene-styrene block copolymer(SBS),and polyolefin(PO) hot melt adhesive had seen a steady increase in sales volume,while high-end varieties such as reactive polyurethane(PUR) hot melt adhesive had grown significantly,becoming important structural growth points.In the downstream application market,demands in transportation,packaging,sanitary materials and other fields had maintained good growth,while traditional markets such as construction and woodworking had tended to stabilize.The growth momentum of hot melt adhesive films for photovoltaics had slowed down.The industry was facing challenges such as intensified competition in the form of "involution",increased profit pressure on enterprises,and complex business environment.Looking ahead to the 15 th Five Year Plan,China's hot melt adhesive industry would focus on innovation driven and steady development,and strive to promote high-end,green,intelligent and international products.Key technologies such as photovoltaic film(POE),UV/EB cured pressure sensitive adhesive,reactive polyurethane(PUR) hot melt adhesive,bio-based and biodegradable adhesive would be emphasized,and the development goal of achieving a total output of 2.825 million tons and sales value of 47.19 billion yuan by 2030 was planned.This article aimed to provide systematic market data and trend references for industry policy formulation,corporate strategic adjustments,and related research.
为适配压敏胶粘带产业发展及新兴领域对耐燃性能的测试需求，本文系统调研了国际（ISO、IEC）及美国、欧盟等国家和地区的压敏胶粘带耐燃性标准现状，深入分析了我国现行GB/T 15903—1995标准在测试方法、评价体系、时效性、环境适应性及特殊材料兼容性等方面的不足。基于国家标准修订计划，在保留原有悬挂试验法的基础上，新增了平放、缠绕、水平燃烧、垂直燃烧及卷筒试验法，构建了多方法、多维度的测试评价体系，明确了各方法的试验原理、试验步骤、试验结果及表示或等级评定规则。修订后的标准技术内容全面，测试方法与国际标准协调一致，突破了原标准方法单一、场景适配性弱的局限，适配电子电器、汽车线束和新能源等多行业应用场景，可为压敏胶粘带的质量管控与产业高质量发展提供技术支撑。
To meet the development needs of pressure sensitive adhesive tape industry and the testing requirements for flame resistance in emerging fields,the current status of flame resistance standards for pressure sensitive adhesive tape issued by international organizations(ISO,IEC) and countries/regions such as the United States and the European Union was systematically investigated in this paper. An in-depth analysis of the deficiencies in China's current national standard GB/T 15903—1995,including aspects of test methods,evaluation systems,timeliness,environmental adaptability,and compatibility with special materials was also conducted.Based on the national standard revision plan,while retaining the original suspension test method,five new test methods of horizontal placement test method,winding test method,horizontal burning test method,vertical burning test method,and roll test method were added.A multi-method,multi-dimensional test and evaluation system was established,with clear specifications for the test principle,test procedure,result calculation,and grade evaluation rules of each method.The revised standard featured comprehensive technical content and test methods that were consistent with international standards.It broke through the limitations of the original standard,such as single test method and weak scenario adaptability,and was suitable for application scenarios in multiple industries including electronics and electrical appliances,automotive wiring harness,and new energy.It could provide technical support for the quality control of pressure sensitive adhesive tape and the high quality development of the industry.
为提升环氧树脂(E-51)/双氰胺体系的热稳定性与铝基粘接性能，本文采用不同含量(2.5%、5.0%、7.5%和10.0%)的对叔丁基苯胺(PTBA)对E-51进行改性处理。结合红外光谱表征和核磁共振氢谱证实了PTBA成功对E-51分子结构进行修饰。通过差示扫描量热法、热重分析及扫描电子显微镜系统地表征了改性前后材料的热性能及微观形貌。研究结果表明：PTBA的引入显著提升了E-51的玻璃化转变温度(Tg)，未改性E-51的Tg为161.20℃，10.0%PTBA改性后Tg提升至198.51℃。改性材料的残碳率大幅提高，5.0%PTBA改性组在500℃下残碳率达16.9%，远高于未改性组的残碳率(6.3%)，同时改性材料的最大失重速率从14.25%/min降至6.98%/min，热分解过程显著延缓。粘接性能分析显示，5.0%PTBA改性体系对铝基材的拉伸剪切强度达24.60 MPa，较未改性体系(18.74 MPa)提升31.3%。扫描电子显微镜表征显示，5.0%PTBA改性后E-51的截面形貌从脆性断裂特征转变为富含褶皱状与阶梯状纹理的韧性断裂结构。PTBA分子中的刚性叔丁基与苯胺基团通过与E-51分子链形成强相互作用，构建刚性交联网络，既限制了分子链热运动，又增强了体系内聚能，从而同步实现了E-51热性能与力学性能的优化。综合性能表明，PTBA添加量为5.0%时，树脂的固化特性、热稳定性及界面粘接性能达到最佳平衡，为其在高温、高要求工况下的应用提供了理论支撑与技术参考。
In order to improve the thermal stability and the aluminum-substrate bonding performance of epoxy resin(E-51)/dicyandiamide system,different contents(2.5%,5.0%,7.5% and 10.0%) of p-tert-butylaniline(PTBA) were used to modify E-51 in this paper.Combined with infrared spectroscopy characterization and nuclear magnetic resonance hydrogen spectroscopy,it was confirmed that PTBA successfully modified the molecular structure of E-51. The thermal properties and microstructure of the modified and unmodified materials were systematically characterized by differential scanning calorimetry,thermogravimetric analysis,and scanning electron microscopy.The research results showed that the introduction of PTBA significantly increased the glass transition temperature(Tg) of E-51.The Tg of unmodified E-51 was 161.20 ℃,and after 10.0% PTBA modification,the Tg increased to 198.51 ℃.The residual carbon rate of the modified material significantly increased,with 5.0% PTBA modified group achieving a residual carbon rate of 16.9% at 500 ℃,much higher than the unmodified group's residual carbon rate(6.3%).At the same time,the maximum weight loss rate of the modified material decreased from 14.25%/min to 6.98%/min,and the thermal decomposition process was significantly delayed. The bonding performance analysis showed that the tensile shear strength of 5.0% PTBA modified system on the aluminum substrate reached 24.60 MPa,which was an increase of 31.3% compared to the unmodified system(18.74 MPa).Scanning electron microscopy characterization showed that the cross-sectional morphology of E-51 modified with 5.0% PTBA changed from brittle fracture characteristics to a ductile fracture structure rich in wrinkled and stepped textures. The rigid tert-butyl and aniline groups in PTBA molecules formed a strong interaction with the E-51 molecular chain,constructing a rigid cross-linked network that not only limited the thermal movement of the molecular chain but also enhanced the energy gathering within the system,thereby simultaneously optimizing the thermal and mechanical properties of E-51.The comprehensive performance showed that when the PTBA addition was 5.0%,the curing characteristics,thermal stability,and interfacial bonding performance of the resin reached the optimal balance,providing theoretical support and technical reference for its application in high temperature and high demand conditions.
缩合型硅酮密封胶是一类以端羟基聚二甲基硅氧烷为基础聚合物，通过缩合反应实现室温硫化的高性能密封材料。本文对缩合型硅酮密封胶的基础工艺配方进行了综述，介绍了基础聚合物聚甲基硅氧烷的分子结构、黏度与复配等因素对硅酮密封胶施工性能、力学等性能的影响。同时对交联剂、催化剂、补强填料、粘接促进剂、增塑剂等组分种类对硅酮密封胶的流变性、力学性能、耐久性以及功能性的影响进行了阐述。最后对硅酮密封胶工艺配方未来的发展方向进行展望，通过分子设计、界面修饰与多组分协同调控，可有效实现产品向快速固化、低模量、高延伸率及环境友好方向发展。然而，多组分间相互作用机理、高性能与低成本之间的平衡，以及替代传统肟类体系的新型环保材料开发仍是当前面临的主要挑战。未来研究应着力于深化构效关系认识，发展深度环保化与功能集成化技术，推动其在新能源、柔性电子等领域的创新应用。
Condensation-type silicone sealant is a high performance sealing material based on hydroxylterminated polydimethylsiloxane polymer,which achieves room temperature vulcanization through condensation reaction.The basic process formulation of condensation-type silicone sealant was reviewed in this paper,and the influence of factors such as molecular structure,viscosity,and compounding of the basic polymer polydimethylsiloxane on the construction performance,mechanical properties,and other properties of silicone sealant was introduced.At the same time,the influence of various components such as crosslinking agents,catalysts,reinforcing fillers,adhesion promoters,and plasticizers on the rheological properties,mechanical properties,durability,and functionality of silicone sealant was elaborated.Finally,the future development direction of silicone sealant process formulation was discussed.Through molecular design,interface modification,and multi-component synergistic regulation,the product could effectively achieve rapid curing,low modulus,high elongation rate,and environmentally friendly development. However,the interaction mechanism between multiple components,the balance between high performance and low cost,and the development of new environmentally friendly materials to replace traditional oxime systems were still the main challenges currently faced.Future research should focus on deepening the understanding of structure-activity relationships,developing deep environmental protection and functional integration technologies,and promoting their innovative applications in fields such as new energy and flexible electronics.
为替代甲苯二异氰酸酯等传统有毒聚氨酯原料，本研究以生物基异山梨醇为原料，经碳酸二甲酯缩聚构建非异氰酸酯聚氨酯（NIPU）主链。利用γ-缩水甘油醚氧丙基三甲氧基硅烷（KH-560）水解缩合与γ-甲基丙烯酰氧丙基三甲氧基硅烷（KH-570）/2-羟乙基甲基丙烯酸酯（HEMA）紫外光固化协同作用，成功制备了有机-无机双网络NIPU胶粘剂（DNIPU），然后测定与表征了各项性能。研究结果表明：有机相与无机相间形成稳定的化学键，构建了完整的双交联网络结构，并且双网络结构显著提升了材料的交联密度与环境稳定性，其中优化配比的DNIPU1在甲苯中凝胶含量达84.09%，是未改性样品的2.1倍；其在聚氨酯基材上的180°剥离强度、剪切强度与拉伸强度分别为0.831 N/mm、0.830 MPa和3.237 MPa，分别是未改性NIPU的13.9倍、5.1倍和4.5倍。同时，DNIPU1的初始分解温度与玻璃化转变温度分别达到207与41.68℃，水接触角升至65.30°，表现出优异的热稳定性与疏水性。该有机-无机双网络策略有效克服了传统NIPU交联密度低、粘接与耐热性能不足的缺陷，为高性能环保结构胶的设计提供了新思路。
To replace traditional toxic polyurethane raw materials such as toluene diisocyanate,bio-based isosorbide was used as the raw material in this study,and a non-isocyanate polyurethane(NIPU) main chain was constructed through dimethyl carbonate condensation.The organic-inorganic dual network NIPU adhesive(DNIPU) was successfully prepared by utilizing the synergistic effect of hydrolysis condensation of γ-glycidoxypropyltrimethoxysilane(KH-560) and UV curing of γ-methacryloyloxypropyltrimethoxysilane(KH-570)/2-hydroxyethyl methacrylate(HEMA),and then various properties were measured and characterized.The research results showed that a stable chemical bond was formed between the organic phase and the inorganic phase,and a complete dual crosslinked network structure was constructed.The dual network structure significantly improved the crosslinking density and environmental stability of the material.The gel content of the optimized proportion of DNIPU1 in toluene reached 84.09%,which was 2.1 times of the unmodified sample.Its 180° peel strength,shear strength,and tensile strength on polyurethane substrate were 0.831 N/mm,0.830 MPa,and 3.237 MPa,respectively,which were 13.9 times,5.1 times,and 4.5 times of the unmodified NIPU,respectively. At the same time,the initial decomposition temperature and glass transition temperature of DNIPU1 reached 207 and 41.68 ℃,respectively,and the water contact angle increased to 65.30°,demonstrating excellent thermal stability and hydrophobicity. This organicinorganic dual network strategy effectively overcame the shortcomings of low crosslinking density,insufficient bonding and heat resistance of traditional NIPU,providing new ideas for the design of high performance and environmentally friendly structural adhesive.
传统酚醛树脂采用石油基苯酚与致癌物质甲醛经反应制备，存在突出的健康安全隐患。利用可再生木质素与生物质基乙二醛部分替代苯酚和甲醛，构建新型酚醛树脂体系，是发展绿色环保木材胶粘剂的主流趋势。本研究以工业木质素和生物基乙二醛为原料，通过替代部分苯酚与甲醛，成功制备了木质素-乙二醛-酚醛树脂（LPGF）胶粘剂。研究结果表明：相对最优的工艺参数为酚醛比1∶0.7，木质素与乙二醛替代率均为50%，热压温度为170℃。所得LPGF胶粘剂的干态胶合强度为（1.86±0.33） MPa，游离苯酚与游离甲醛含量分别为0.45%与0.26%，满足GB/T 14732—2017标准要求。红外光谱分析证实，乙二醛与木质素发生交联反应并生成醚键。热性能分析表明，LPGF的固化峰值温度（117.50℃）显著低于传统酚醛树脂，有利于降低能耗；但其热稳定性亦有所下降，残碳率（56.43%）与最大失重速率温度（359.74℃）均低于传统酚醛树脂，主要归因于乙二醛反应活性较低，难以形成如甲醛般致密稳定的交联结构。总之，该LPGF胶粘剂在保持较好胶合性能的同时，显著降低了传统酚醛树脂对石油基苯酚与甲醛的依赖，具备良好的环境友好特性，在人造板领域具有应用潜力。后续研究可围绕木质素的活化改性及树脂交联结构优化展开，以进一步提升其综合性能。
Traditional phenolic resin is prepared by reacting petroleum-based phenol with carcinogenic substance formaldehyde,which poses significant health and safety risks.The mainstream trend in developing green and environmentally friendly wood adhesive is to partially replace phenol and formaldehyde with renewable lignin and bio-based formaldehyde to construct a new type of phenolic resin system. Lignin-glyoxal-phenolic resin(LPGF) adhesive was successfully prepared in this study by using industrial lignin and bio-based formaldehyde as raw materials,replacing some phenol and formaldehyde. The research results showed that the relatively optimal process parameters were the phenol-formaldehyde ratio of 1∶0.7,the substitution rate of 50% for both lignin and formaldehyde,and the hot pressing temperature of 170 ℃.The dry bonding strength of the obtained LPGF adhesive was(1.86±0.33) MPa,with free phenol and free formaldehyde contents of 0.45% and 0.26%,respectively,meeting the requirements of GB/T 14732—2017 standard. Infrared spectroscopy analysis confirmed that formaldehyde underwent crosslinking reaction with lignin and formed ether bonds.Thermal performance analysis showed that the curing peak temperature of LPGF(117.50 ℃) was significantly lower than that of traditional phenolic resin,which was beneficial for reducing energy consumption.However,its thermal stability also decreased,with a lower residual carbon rate(56.43%) and maximum weight loss rate temperature(359.74 ℃) compared to traditional phenolic resin,mainly due to the lower reactivity of formaldehyde reaction,making it difficult to form a dense and stable cross-linked structure like formaldehyde.In summary,this LPGF adhesive significantly reduced the dependence of traditional phenolic resins on petroleum-based phenol and formaldehyde while maintaining good bonding performance,and had good environmentally friendly properties,with potential applications in the field of artificial boards. Subsequent research could focus on the activation modification of lignin and optimization of resin crosslinking structure to further enhance its comprehensive performance.
以双酚A型环氧树脂（E-51）为主体树脂，通过引入自制的增韧剂聚烯丙基芳砜醚酮（PAEK），与固化剂（4,4′-二氨基二苯砜、甲基四氢苯酐）及促进剂（2-乙基-4-甲基咪唑）复合，制备了系列改性环氧胶粘剂（EPA-1～EPA-5），并对其性能及固化动力学进行研究。研究结果表明：PAEK的加入显著提升了材料的力学性能，当添加量为10份（EPA-4）时，冲击强度、拉伸强度、弯曲强度分别达到26.1 kJ/m2、78.1 MPa和104.6 MPa。在1 000 kHz频率下，各配方的相对介电常数在3.46～4.18之间，介电损耗低于2.19%，吸水率均小于0.20%，展现出优异的介电性能与疏水性。固化动力学分析显示，EPA-2的表观活化能为73.41 kJ/mol，反应级数为0.9。该胶粘剂体系综合性能优良，在高端电子与航空航天领域具有应用潜力。
A series of modified epoxy adhesive(EPA-1-EPA-5) were prepared by using bisphenol A type epoxy resin(E-51) as the main resin,introducing self-made toughening agent polyallyl aromatic sulfone ether ketone(PAEK),compounding with curing agents(4, 4′-diaminodiphenyl sulfone,methyltetrahydrophthalic anhydride) and accelerator(2-ethyl-4-methylimidazole),and their properties and curing kinetics were studied.The research results showed that the addition of PAEK significantly improved the mechanical properties of the material.When the addition amount was 10 phr(EPA-4),the impact strength,tensile strength,and bending strength reached 26.1 kJ/m2,78.1 MPa,and 104.6 MPa,respectively.At the frequency of 1 000 kHz,the relative dielectric constant of each formula ranged from 3.46 to 4.18,with a dielectric loss of less than 2.19% and a water absorption rate of less than 0.20%,demonstrating excellent dielectric properties and hydrophobicity. The curing kinetics analysis showed that the apparent activation energy of EPA-2 was 73.41 kJ/mol,and the reaction order was 0.9.The adhesive system had excellent comprehensive performance and had potential applications in high-end electronics and aerospace fields.