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碳纤维增强环氧树脂基复合材料的性能研究
Study on performance of composite material based on epoxy resin reinforced by carbon fiber
张杰;宁荣昌;李红;齐大伟;凌辉; ZHANG Jie,NING Rong-chang,LI Hong,QI Da-wei,LING Hui(Department of Applied Chemistry,Northwestern Polytechnical University,Xi’an 710129,China)研究了WBS-3环氧树脂固化体系的反应特性,分析了该固化体系浇铸体的性能;并以碳纤维(T-700S)为增强材料,采用手糊成型螺栓加压工艺制备了WBS-3/T-700S复合材料,研究了复合材料的常温力学性能、高温力学性能、水煮后力学性能和动态力学性能,并对弯曲断面进行分析。研究结果表明,WBS-3树脂基体黏度低、适用期长且韧性好,适合于手糊成型、缠绕成型等低成本制造工艺;由此制得的WBS-3/T-700S复合材料具有优良的力学性能和耐高温性能,其弯曲强度为1434MPa,拉伸强度为1972MPa,剪切强度为76.1MPa,玻璃化温度(Tg)超过210℃;该WBS-3/T-700S复合材料具有很好的界面粘接性(树脂对纤维的浸润性良好)、较低的空隙率且纤维分布均匀。
The reaction characteristics of WBS-3 epoxy resin curing system were studied,and the casting performances of curing system were analysed. With carbon fiber(T-700S) as enhanced material,the WBS-3/T-700S composite material was prepared by hand-paste molding and bolt press technology. The mechanics performance at room temperature,mechanics performance at high temperature,mechanics performance after boiled and dynamic mechanics performance were studied and the crimped section was analysed for WBS-3/T-700S composite material. The research results showed that the WBS-3 resin matrix had a series of characteristics such as low-viscosity,a long working life and good toughness,was suitable for paste molding by hand,winding molding and other low-cost manufacture technology. The WBS-3/T-700S composite material had excellent mechanics performance and hightemperature resistance,such as the flexural strength was 1 434 MPa,the tensile strength was 1 972 MPa,the shear strength was 76.1 MPa and Tg exceed 210 ℃. The WBS-3/T-700S composite material had good interface bonding performance(namely good soakaged of resin to fiber),low porosity,and evenly distributing fiber.
酚醛树脂的研究现状、工业化应用需求及展望
Research status,industrial application demand and prospect of phenolic resin
徐雁茹;张浩楠;翟华敏;任浩; Xu Yanru;Zhang Haonan;Zhai Huamin;Ren Hao;综述了酚醛树脂胶粘剂的主要合成工艺及最新研究进展、国内主要酚醛树脂企业产能分布,分析了国内酚醛树脂的消费情况、进出口量及价格走势。同时对国内现有酚醛树脂胶粘剂在胶合板中的应用市场进行了调研与讨论,为更好地研制符合国家发展需求、品质和经济上有竞争力的酚醛树脂胶粘剂提供参考。
The main synthetic process and latest research progress of phenolic resin adhesives were reviewed.The production capacity distribution of main phenolic resin enterprises in China was summarized. The consumption situation,import and export volume and price trend of phenolic resin in China were analyzed. At the same time,the application market of phenolic resin adhesives in plywood was investigated and discussed,which could provide reference for the development of phenolic resin adhesives that meet the national development needs,quality and economic competitiveness.
热熔胶研究进展
Research progress of hot-melt adhesives
郭静;相恒学;王倩倩;管福成; GUO Jing,XIANG Heng-xue,WANG Qian-qian,GUAN Fu-cheng(School of Chemistry Engineering & Material,Dalian Polytechnic University,Dalian 116034,China)从传统型和可生物降解型两个方面介绍了热熔胶的研究进展。根据热熔胶所用基体树脂类型,传统型热熔胶分为聚氨酯(PU)类、聚酰胺(PA)类和乙烯/醋酸乙烯(EVA)类等,可生物降解型热熔胶分为聚乳酸型、聚酯酰胺型、聚羟基烷酸酯型和天然高分子型等。传统型热熔胶由于其结构的不可降解性,对环境造成了较大的危害;而可生物降解型热熔胶,符合环保理念,潜在市场大。在查阅国内外文献的基础上,对可生物降解型热熔胶提出了今后的研究和发展方向。
The recent research developments of hot-melt adhesive were introduced from traditional and biodegradable aspects.According to the different matrix resin,the traditional hot-melt adhesive could divide into polyurethane(PU),polyamide(PA) and ethylene/vinyl acetate(EVA),but the biodegradable hot-melt adhesive could divide into polylactic acid,polyester amide,polyhydroxyalkanoates,natural polymer and so on.The traditional hot-melt adhesive cannot be degraded in the natural environment because of its structure,so it had biggish damage to environment.But the biodegradable hot-melt adhesive,which was accordant with environmental protection concepts,had biggish potential market.Moreover,the further research and development direction of biodegradable hot-melt adhesive were also presented based on the literature at home and abroad.
酚醛树脂胶粘剂的研究进展
Research progress of phenol-formaldehyde resin adhesive
乔吉超;胡小玲;管萍; QIAO Ji-chao, HU Xiao-ling, GUAN Ping Department of Chemical Engineering,Northwestern Polytechnical University,Xi'an 710072,China主要介绍了酚醛树脂胶粘剂的研究现状与进展方向,综述了酚醛树脂和酚醛树脂胶粘剂的改性方法。性能的改善提高了酚醛树脂胶粘剂的应用价值,扩大了其使用范围。
In this paper,the current status of research and prospect on phenol -formaldehyde resin adhesive were introduced. Modification of phenol-formaldehyde resin and phenol-formaldehyde resin adhesive were reviewed. The phenol-formaldehyde resin adhesive has good application value and wide application range.
环保型水性涂料研究进展及发展趋势
Research progress and development trend of environment-friendly waterborne coatings
孟令巧;史星照;周志平;郝桐帆;张瑞龙;聂仪晶; Meng Lingqiao;Shi Xingzhao;Zhou Zhiping;Hao Tongfan;Zhang Ruilong;Nie Yijing;本文综述了近年来国内外相关各类环保型水性涂料的研究进展与成果,介绍了水性聚氨酯、水性丙烯酸树脂、水性环氧树脂及其改性树脂在涂料中的应用,并对水性涂料在未来工业应用中的发展前景和方向作出了展望。
In this article,the research progress and achievements of environment-friendly waterborne coatings in recent years at home and abroad were reviewed. The application of waterborne polyurethane,waterborne acrylic resin,waterborne epoxy resin and their modified resins for coatings were also introduced. The development prospect and direction of waterborne coatings in future industrial application were prospected.
水性环氧树脂的制备与应用研究进展
Progress in preparation and application of waterborne epoxy resin
张广鑫;王文博;李胜; Zhang Guangxin;Wang Wenbo;Li Sheng;详细介绍了水性环氧树脂制备方法中的相反转法、化学乳化法、固化剂乳化法和机械法的特点,并重点介绍了水性环氧树脂在防腐领域、道路建设、复合材料、涂料等领域的应用。对近些年来水性环氧树脂应用情况进行了总结,并对未来环氧树脂的应用及研发进行了展望。
The characteristics of preparation methods of waterborne epoxy resin were introduced in details,such as reverse conversion method,chemical emulsification method,curing agent emulsification method and mechanical method. The application of waterborne epoxy resin in the fields of anti-corrosion,road construction,composite materials,coatings and other fields was emphatically introduced. The application of waterborne epoxy resin in recent years was summarized,and the application,research and development of epoxy resin in the future were prospected.
丙烯酸酯胶粘剂研究进展
Developments of acrylate adhesives
熊林,王建营,延玺,胡文祥 XIONG Lin 1,2 ,WANG Jian ying 1 ,YAN Xi 2 ,HU Wen xiang 1 (1. Institute of Military Medicine, Headquarters of General Equipment, Beijing 100101, China; 2. Department of chemistry, Beijing Normal University, Beijing 100875, China)分析了丙烯酸酯的反应特点 ,介绍了以丙烯酸酯主要原料的几种胶粘剂的组分及其应用 ,讲述了当今国内外丙烯酸酯胶粘剂的研究趋势和研究进展
This paper introduces the characterisitics of acrylates in chemistry reactions and the compositions, and the applications of acrylate adhesive and provides their research current and development at home and abroad.
微电子封装材料及其可靠性研究进展
Research progress in microelectronic packaging materials and their reliability
王娟娟;余英丰;景华;刘黎成;徐子曦; Wang Juanjuan;Yu Yingfeng;Jing Hua;Liu Licheng;Xu Zixi;随着微电子产业的发展，各种封装技术不断涌现，对于封装材料的内应力、导热性、电性能都提出了更高的要求。本文介绍了聚合物微电子封装的主要材料，包括环氧树脂、有机硅、聚酰亚胺。由于封装的无铅化发展以及高功率导致的散热需求，导电胶和热界面材料成了在封装中研究的较多热门材料。根据产品的使用环境，通过加速试验（温度循环、高加速应力试验、疲劳试验等）可以评估封装的可靠性。为探索封装失效的原因，需要对产品进行失效分析。本文介绍了常用的失效分析技术，具体描述了倒装芯片的底填胶的失效分析，并根据失效原因对底填材料提出了性能要求。封装材料的冷热冲击和湿热稳定性是影响可靠性的重要因素，湿气会导致封装“爆米花效应”、电化学迁移等后果从而使器件失效。为此，本文探究了湿气对半导体器件的影响及扩散机理，并对影响材料吸水性能的因素（如极性、自由体积、材料微相分离等）进行了综述。最后，还对微电子封装材料的未来发展进行了展望。
With the development of microelectronic industry,a variety of packaging technologies are emerging,which put forward higher requirements for the internal stress,thermal conductivity and electrical properties of packaging materials. In this paper,the main materials for polymer microelectronic packaging,including epoxy resin,silicone,and polyimide were introduced. Due to the development of lead-free packaging and the need for heat dissipation of high power,conductive adhesive and thermal interface materials had become the more popular materials in the packaging research. According to the use environment of the product,the reliability of packaging could be evaluated by accelerated test(temperature cycle,high accelerated stress test,fatigue test,etc.).In order to explore the causes of packaging failure,it was necessary to carry out failure analysis for the product. In this paper,the commonly used failure analysis technology was introduced,the failure analysis of the underfill adhesive of flip chip was specifically described,and the performance requirements for the underfill material were put forward according to the failure reasons. The cold/thermal shock and hygrothermal stability of packaging materials were important factors affecting the reliability,moisture could lead to package“popcorn effect”,electrochemical migration and other consequences,which would make the device fail. For this reason,in this paper,the effect and diffusion mechanism of moisture on semiconductor devices were explored,and the factors affecting the water absorption performance of materials(such as polarity,free volume,material micro-phase separation,etc.)were reviewed. Finally,the future development of microelectronic packaging materials was also prospected.
碳纤维增强树脂基复合材料的最新应用现状
The latest application status of carbon fiber reinforced resin matrix composites
彭金涛;任天斌; Peng Jintao;Ren Tianbin;介绍了碳纤维增强树脂基复合材料的性能特点,结合碳纤维增强树脂基复合材料的优异性能,讨论了其在新能源(风力发电、钻井采油和天然气储存)、汽车(外覆盖件、刹车片和涡轮增压)和航空航天(民用飞机、战略导弹)领域的最新应用。最后对碳纤维增强树脂基复合材料未来的发展方向进行了展望。
The performance features of carbon fiber reinforced resin matrix composite were introduced. Incombination with the excellent properties of carbon fiber reinforced resin matrix composites,its newest applicationswere discussed in new energy field(such as wind power generation,oil drilling,and natural gas storage),automobilefield(such as outer covering parts,brake pads,and turbocharged),and aerospace field(such as civilian aircraft,andstrategic missile). Finally,the future development direction of carbon fiber reinforced resin matrix composite wasexpected.
UV光固化胶粘剂的研究进展
Research progress on UV light-curing adhesive
李建波; Li Jianbo;阐述了UV光固化胶粘剂的发展历史、组成和特点，系统介绍了不同种类UV胶（自由基固化型、阳离子固化型、自由基/阳离子混杂型、延迟固化、UV/湿气双重固化、UV/热双重固化、UV热熔胶、UV压敏胶、UV减粘胶、可拆卸的UV胶、UV光学胶以及其他）的特点、固化机理、材料结构设计以及性能调控方法等。总结了近年来各种UV胶的最新研究进展，最后对UV胶在各个领域的应用、挑战和未来发展方向提出了展望。
The development history,composition and characteristics of UV light-curing adhesive were elaborated. The characteristics,curing mechanism,material structure design and performance optimization of different kinds of UV adhesive(free-radical curing type,cationic curing type,free radical/cationic hybrid type,delayed curing,UV/moisture dual curing,UV/thermal dual curing,UV hot melt adhesive,UV pressure sensitive adhesive,UV viscosity-reducing adhesive,detachable UV adhesive,UV optical adhesive and others)were systematically introduced.The latest research progress of various UV adhesive in recent years was summarized,and finally,the application,challenges,and future development direction of UV adhesive in various fields were prospected.