中国胶粘剂

以二烯丙基双酚A(DABPA)与二烯丙基双酚S(DABPS)复配改性2,2-双[4-(4-马来酰亚胺苯氧基)苯基]丙烷(BAPP-BMI)树脂，制备了一种新型耐高温胶粘剂(J01)。采用差示扫描量热法研究了其固化动力学，并对固化物的力学性能、电学性能及吸水性能进行了表征。研究结果表明：耐高温胶粘剂J01的固化工艺为190℃/2 h+220℃/2 h+250℃/2 h+275℃/2 h，表观活化能为102.5 kJ/mol，反应级数为0.917。DABPA/DABPS/BAPP-BMI体系具有良好的力学性能，冲击强度、拉伸强度和弯曲强度分别为37.1 kJ/m²、64.7 MPa和93.4 MPa；胶粘剂的粘接性能良好，室温拉伸剪切强度为15.5 MPa，当温度为300℃时，仍保留4.6 MPa的剪切强度。该体系胶粘剂在宽广的频率范围保持优异的介质稳定性，电容值稳定在4.57～4.65 pF，且具有低介电常数(3.53～3.58)和低介电损耗(0.007 78～0.010 80)，绝缘性好，介电性能优异，测得固化物的平均吸水率为0.38%。综合测试分析表明，该胶粘剂兼具良好的耐热性、力学性能、介电性能与耐湿热稳定性，在高可靠性电子封装领域具有广阔的应用前景。

A novel high temperature resistant adhesive(J01) was prepared by compounding and modifying 2, 2-bis[4-(4-maleimidophenoxy) phenyl] propane(BAPP-BMI) resin with diallylbisphenol A(DABPA) and diallylbisphenol S(DABPS).The curing kinetics were studied by using differential scanning calorimetry,and the mechanical,electrical,and water absorption properties of the cured material were characterized.The research results showed that the curing process of high temperature resistant adhesive J01 was 190 ℃/2 h+220 ℃/2 h+250 ℃/2 h+275 ℃/2 h,with the apparent activation energy of 102.5 kJ/mol and the reaction order of 0.917.The DABPA/DABPS/BAPP-BMI system had excellent mechanical properties,with impact strength,tensile strength,and bending strength of 37.1 kJ/m²,64.7 MPa,and 93.4 MPa,respectively.The adhesive had good bonding performance,with the tensile shear strength of 15.5 MPa at room temperature.When the temperature was 300 ℃,the shear strength of 4.6 MPa was still retained. The adhesive system maintained excellent dielectric stability over a wide frequency range,with the stable capacitance value of 4.57-4.65 pF,low dielectric constant(3.53-3.58) and low dielectric loss(0.007 78-0.010 80).It had good insulation and excellent dielectric properties.The average water absorption rate of the cured product was measured to be 0.38%.Comprehensive testing analysis showed that the adhesive had good heat resistance,mechanical properties,dielectric properties,and moisture and heat stability,demonstrating broad application prospects in the field of high reliability electronic packaging.