中国胶粘剂

以酚醛型氰酸酯树脂作为导电胶基体，以片状银粉作为填充材料，制备了耐高温型导电胶。采用咪唑类固化剂、醋酸酯类稀释剂调节导电胶的固化工艺和黏度，并对其进行了热机械性能、机械强度和导电/导热性能研究。研究结果表明：导电胶的玻璃化转变温度为232℃，100和250℃时的动态模量分别为6 271、273 MPa，玻璃化转变前的热膨胀系数为36.63μm/(m·K)，高温时可稳定施工作业；该导电胶在320℃条件下静置10 min后剪切强度提升40%，说明高温处理不会影响导电胶的剪切强度；该导电胶的体积电阻率极低(3.48×10^-6Ω·m)，导电性能优异，优于市场上同类导电胶。

The conductive adhesive with high temperature resistance was prepared with phenolic cyanate resin as the conductive adhesive matrix and flake silver powder as the filler material.Imidazole curing agent and acetate diluent were used to adjust the curing process and viscosity of conductive adhesive,and its therma mechanical properties,mechanical strength and electrical/thermal conductivity were studied.The research results showed that the glass transition temperature of conductive adhesive was 232℃，the dynamic modulus at 100℃and250℃were 6 271 and 273 MPa respectively,the coefficient thermal expansion before the glass transition was36.63μm/(m·K),and the construction work could be stabilized at high temperature.The shear strength o conductive adhesive increased by 40%after kept at 320℃for 10 min,indicating that high temperature treatment did not affect the shear strength of conductive adhesive.The volume resistivity of this conductive adhesive was extremely low(3.48×10^-6Ω·m),the electrical conductivity was excellent,which was superior to similar conductive adhesive on the market.