中国胶粘剂

喷墨打印是一种较为新颖的无接触式印刷技术，高效、经济、环保的特点使其在阻焊制程中有广泛的发展前景。本研究通过对比紫外光固化涂层的固化速度、附着力和硬度等性能，从市售的5种阳离子单体中，优选出脂环族环氧单体3,4-环氧环己基甲酸-3’,4’-环氧环己基甲酯（TTA-21）作为杂化体系的阳离子单体。选择质量比为2∶3的TTA-21/1,6-己二醇二丙烯酸酯（HDDA）混杂体系配方为研究对象，对其反应转化率、固化程度、热性能、热稳定性以及所制备油墨在阻焊中的应用进行研究。研究结果表明：（1）在LED光照下，自由基组分和阳离子组分均会发生聚合反应，自由基体系的反应速度快，且反应转化率更高；阳离子反应速度慢，且转化率相对低，短时间内持续的光照并不能显著提升阳离子的反应转化率；在光-热双重固化下，阳离子环氧开环聚合与自由基双键加成反应的反应程度增加，固化进行得更彻底。（2）杂化体系的固化产物存在两相，但是热重曲线显示只有一个失重曲线，说明杂化体系经过LED加热烘烤后，体系中可能形成了互穿交联网络结构；环氧组分和丙烯酸组分存在一定的微相分离结构，这种微相分离结构提升了固化膜的综合性能。（3）应用研究表明，制备的合格阻焊墨水黏度为8～14 mPa·s(45℃)，表面张力在22 mN/m左右，粒径在135～150 nm范围，耐溶剂、耐酸碱和耐焊锡性能均可以满足阻焊墨水的要求。

Inkjet printing is a relatively novel non-contact printing technology and has broad development prospects with its high efficiency,economy and environmental features in solder resist process.In this study,the curing speed,adhesion,and hardness of UV cured coating were compared,and 3, 4-epoxycyclohexylformate-3',4'-epoxycyclohexylmethyl ester(TTA-21) as the cationic monomer for the hybrid system was selected from five commercially available cationic monomers.The TTA-21/1,6-hexanediol diacrylate(HDDA) hybrid system with a mass ratio of 2∶3 was selected as the research object,and its reaction conversion rate,curing degree,thermal performance,thermal stability,and the application of the prepared ink in solder resist were studied.The research results showed that:(1) Under LED illumination,both free radical and cationic components underwent polymerization reactions. The reaction rate of the free radical system was faster and the conversion rate of the reaction was higher. The reaction rate of cationic system was slow and the conversion rate was relatively low.Continuous light exposure in a short period of time could not significantly improve the conversion rate of cationic system.Under photothermal dual curing,the degree of reaction between cationic epoxy ring opening polymerization and free radical double bond addition reaction increased,and the curing process was more thorough.(2) The cured products of the hybrid system had two phases,but the thermogravimetric curve showed only one weight loss curve,indicating that the hybrid system may form an interpenetrating cross-linked network structure after LED heating and baking. There was a certain microphase separation structure between the epoxy component and the acrylic component,which enhanced the overall performance of the cured film.(3)The application study showed that the prepared qualified solder resist ink had the viscosity of 8-14 mPa·s(45 ℃),the surface tension of around 22 mN/m,and the particle size range of 135-150 nm.Its solvent resistance,acid and alkali resistance,and solder resistance could all meet the requirements of solder resist ink.