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2024, 04, v.33 53-59
星载微波介质谐振器高可靠粘接技术研究
Research on high reliability bonding technology for space-borne microwave dielectric resonator
基金项目(Foundation):
邮箱(Email):
DOI: 10.13416/j.ca.2024.04.007
发布时间: 2024-04-30
出版时间: 2024-04-30
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摘要:

介质谐振器是星载微波多工器的核心组件,是通信卫星有效载荷的关键组成部分。介质谐振器一般由圆柱形的低损耗、高介电常数、对温度变化稳定的陶瓷介质制成,通常采用胶粘剂粘接在专用螺钉上,并通过石英管或柱调节在多工器腔体中的位置。针对星载微波介质陶瓷谐振器粘接技术中存在的关键难点,通过对选胶、粘接、试验验证等全流程进行控制,设计专用工装保证粘接同轴度、粘接压力、胶粘剂用量等工艺因素,同时保证粘接可靠性和介质谐振器的高Q值,并按照星载产品的试验量级进行了热学、力学、辐照验证,实现了微波介质陶瓷材料的高可靠粘接,从而获得性能优异的星载微波无源产品。研究结果表明:星载微波介质谐振器的粘接工艺由胶液特性、粘接面粗糙度及胶液使用控制工艺所决定。一个满足宇航级使用的谐振器,在特定的工艺参数下通过宇航级的试验验证才可具备宇航飞行的资格。

Abstract:

Dielectric resonator is the core component of the space-borne microwave dielectric multiplexer and is a key component of the payload of communications satellite. Dielectric resonator is generally made of cylindrical ceramic media with low loss,high dielectric constant,and stability to temperature changes. Usually,adhesive is used to bond onto specialized screws and adjust the position in the multiplexer chamber through quartz tubes or columns.In response to the key difficulties in the bonding technology of space-borne microwave dielectric ceramic resonator,a dedicated fixture was designed to control the entire process of adhesive selection,bonding,and experimental verification,ensuring process factors such as adhesive coaxiality,bonding pressure,and adhesive dosage.Simultaneously ensuring the reliability of bonding and the high Q value of the dielectric resonator,thermal,mechanical and radiation verifications were carried out according to the experimental level of space-borne products,achieving high reliability bonding of microwave dielectric ceramic materials and obtaining highperformance space-borne microwave passive products. The research results showed that the bonding process of space-borne microwave dielectric resonator was determined by the characteristics of the adhesive,the roughness of the bonding surface,and the control process of the adhesive usage. A resonator that met the requirements for aerospace use could only be qualified for aerospace flight after passing aerospace level testing verification under specific process parameters.

基本信息:

DOI:10.13416/j.ca.2024.04.007

中图分类号:TQ430.7;V46

引用信息:

[1]樊田,张乐,樊凯,等.星载微波介质谐振器高可靠粘接技术研究[J].中国胶粘剂,2024,33(04):53-59.DOI:10.13416/j.ca.2024.04.007.

Citation Information:

[1]Fan Tian,Zhang Le,Fan Kai ,et al.Research on high reliability bonding technology for space-borne microwave dielectric resonator[J].中国胶粘剂,2024,33(04):53-59.DOI:10.13416/j.ca.2024.04.007.

发布时间:

2024-04-30

出版时间:

2024-04-30

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