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以丙烯酸-2-羟基乙酯(HEA)、γ-缩水甘油醚氧丙基三甲氧基硅烷(KH-560)和正硅酸乙酯(TEOS)为主要原料,制备了两种加成型有机硅灌封胶用粘接增强剂。采用红外光谱(FT-IR)法对其结构进行了表征,并探讨了两种粘接增强剂对灌封胶及其铝基胶接件的剪切强度、黏度、拉伸强度、断裂伸长率和硬度等影响。结果表明:粘接增强剂的引入能明显提高灌封胶的粘接性能,其中含环氧基粘接增强剂的增强效果相对较好;当w(含环氧基粘接增强剂)=0.6%(相对于灌封胶总质量而言)时,灌封胶的剪切强度(1.21 MPa)比无粘接增强剂体系提高了570%左右。
Abstract：With HEA(2-hydroxy ethyl acrylate),KH-560 and TEOS as main raw materials,the two adhesion promoters for polyaddition type organic silicone encapsulants were prepared.Their structures were characterized by infrared spectroscopy(FT-IR),and the influences of two adhesion promoters on some properties such as shear strength,viscosity,tensile strength,elongation at break and hardness of encapsulants and aluminum-cementing samples were discusses.The results showed that the adding adhesion promoter could obviously improve bonding properties of encapsulants,and the reinforcing effect of adhesion promoter with epoxy group was relatively better.The shear strength(1.21 MPa) of encapsulant with adhesion promoter was about 570% more than that without adhesion promoter when mass fraction of adhesion promoter with epoxy group was 0.6% in total encapsulant.
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基本信息:
DOI：10.13416/j.ca.2012.12.022
中图分类号:TQ637
引用信息:
[1]范志山,胡新嵩,潘科学,等.加成型有机硅灌封胶的粘接性能研究[J].中国胶粘剂,2012,21(12):4-7.DOI:10.13416/j.ca.2012.12.022.
2012-12-30
2012-12-30