| 329 | 1 | 8 |
| 下载次数 | 被引频次 | 阅读次数 |
以3,4-环氧环己基甲酸-3′,4′-环氧环己基甲酯(CE)为阳离子光聚合环氧树脂,掺杂环氧基三甲氧基硅烷(NQ561)进行紫外光聚合研究。利用红外光谱监测辐照过程中可能发生的反应,引发剂PAG-201吸收紫外光分解造成的强酸环境不仅激发环氧开环聚合,同时促进NQ561进行水解-缩合反应,形成环氧有机硅互穿网络结构,并对所有混合体系的力学性能进行了研究。研究结果表明:NQ561的加入明显加速了开环聚合反应过程,并提高环氧基最终转化率。对比不同原料配比混合体系的热机械性能发现,随着NQ561含量的增加,光固化样的玻璃化转变温度(Tg)逐渐降低,热膨胀系数(CTE)增大。当m(NQ561)∶m(CE)=20∶80时,其拉伸强度和断裂伸长率达到最大值,同时空气氛围下进行的热重分析显示热稳定性有所提高。
Abstract:Taking 3,4-epoxycyclohexylmethyl-3′,4′-epoxycyclohexane carboxylate(CE)as cationic photopolymerized resin and mixing with epoxy-functionalized trimethoxysilane(NQ561),the UV polymerization was studied. The possible reactions during irradiation were monitored by infrared spectroscopy. The strong acid environment generated by UV decomposition of initiator PAG-201 not only induced the ring-opening polymerization of epoxy,but also promoted the hydrolysis-condensation reaction of NQ561,resulting in the formation of epoxy-siloxane interpenetrating network structure. The mechanical properties of all hybrid systems were then studied. The research results showed that the addition of NQ561 significantly accelerated the ringopening polymerization process and improved the final conversion rate of epoxy group. Comparing the thermomechanical properties of hybrid systems with different raw material ratios,it was found that with the increase of NQ561 content,the glass transition temperature(Tg)of UV cured samples gradually decreased and the coefficient of thermal expansion(CTE)increased. When m(NQ561)∶m(CE)=20∶80,the tensile strength and elongation at break reached the maximum. At the same time,thermogravimetric analysis performed in air atmosphere revealed that the thermal stability was improved.
[1]FICEK B A,THIESEN A M,SCRANTON A B.Cationic photopolymerizations of thick polymer systems:Active center lifetime and mobility[J].European Polymer Journal,2008,44(1):98-105.
[2]ATIF M,BONGIOVANNI R,YANG J.Cationically UV-cured epoxy composites[J].Polymer Reviews,2015,55(1):90-106.
[3]SANGERMANO M,RAZZA N,CRIVELLO J V.Cationic UV-curing:Technology and applications[J].Macromolecular Materials and Engineering,2014,299(7):775-793.
[4]YAGCI Y,JOCKUSCH S,TURRO N J.Photoinitiated polymerization:Advances,challenges,and opportunities[J].Macromolecules,2010,43(15):6245-6260.
[5]JIANG T,HE Y,JIAN Y,NIE J.Exploration for decreasing the volume shrinkage for photopolymerization[J].Progress in Organic Coatings,2012,75(4):398-403.
[6]ORTIZ R A,DUARTE M L B,GóMEZ A G S,et al.Novel diol spiro orthocarbonates derived from glycerol as antishrinkage additives for the cationic photopolymerization of epoxy monomers[J].Polymer International,2010,59(5):680-685.
[7]WANG T,WANG Z H.Cationic photopolymerization of epoxy systems initiated by cyclopentadien-iron-biphenyl hexafluorophosphate([Cp-Fe-biphenyl]+PF6-)[J].Polymer Bulletin,2005,53(5-6):323-331.
[8]SANGERMANO M,ORTIZ R A,URBINA B A P,et al.Synthesis of an epoxy functionalized spiroorthocarbonate used as low shrinkage additive in cationic UV curing of an epoxy resin[J].European Polymer Journal,2008,44(4):1046-1052.
[9]SANGERMANO M,MALUCELLI G,DELLEANI G,et al.Bicyclo-orthoester as a low-shrinkage additive in cationic UV curing[J].Polymer International,2007,56(10):1224-1229.
[10]CHIANG T H,HSIEH T E.A study of UV-curable epoxide resins containing thermal accelerator-tertiary amines[J].Reactive and Functional Polymers,2008,68(2):601-612.
[11]MURIAS P,MACIEJEWSKI H,GALINA H.Epoxy resins modified with reactive low molecular weight siloxanes[J].European Polymer Journal,2012,48(4):769-773.
[12]NAGUIB M,SANGERMANO M,CAPOZZI L C,et al.Nonreactive and reactive block copolymers for toughening of UV-cured epoxy coating[J].Progress in Organic Coatings,2015,85:178-188.
[13]SASAKI H.Curing properties of cycloaliphatic epoxy derivatives[J].Progress in Organic Coatings,2007,58(2-3):227-230.
[14]PUTZIEN S,LOUIS E,NUYKEN O,et al.UV curing of epoxy functional hybrid silicones[J].Journal of Applied Polymer Science,2012,126(4):1188-1197.
[15]LEE A S,CHOI S S,SONG S J,et al.Cationically photopolymerizable epoxy-functionalized thermoplastic polysilsesquioxanes:Synthesis and properties[J].RSCAdvances,2014,4(99):56532-56538.
[16]KWAK S Y,YANG S,KIM N R,et al.Thermally stable,dye-bridged nanohybrid-based white light-emitting diodes[J].Advanced Materials,2011,23(48):5767-5772.
[17]YANG X,HUANG W,YU Y.Synthesis,characterization,and properties of silicone-epoxy resins[J].Journal of Applied Polymer Science,2011,120(2):1216-1224.
[18]GAO J,SUN B,LI X,et al.UV-curable coating of unsaturated polyester/epoxy resins containing polyhedral oligomeric silsesquioxanes[J].International Journal of Polymeric Materials,2011,60(12):1000-1014.
[19]HUANG W,ZHANG Y,YU Y,et al.Studies on UV-stable silicone-epoxy resins[J].Journal of Applied Polymer Science,2007,104(6):3954-3959.
[20]GIULIO M,EZIO A,MATTEO M,et al.Epoxy-siloxane hybrid coatings by a dual-curing process[J].Advances in Polymer Technology,2009,28(2):77-85.
[21]GAO N,LIU W,YAN Z,et al.Synthesis and properties of transparent cycloaliphatic epoxy-silicone resins for optoelectronic devices packaging[J].Optical Materials,2013,35(3):567-575.
[22]CHEMTOB A,VERSACE D L,BELON C,et al.Concomitant organic-inorganic UV-curing catalyzed by photoacids[J].Macromolecules,2008,41(20):7390-7398.
[23]BELON C,CHEMTOB A,RIGOLET S,et al.Nanocomposite coatings via simultaneous organicinorganic photo-induced polymerization:Synthesis,structural investigation and mechanical characterization[J].Polymer International,2010,59(8):1175-1186.
[24]QI Y,LI L,FANG Z,et al.Morphologies and applied properties of free radical/cationic UV-cured CPUA/TMPTMA/CER composite films[J].Polymer Composites,2015,36(7):1177-1185.
[25]YANG S C,KWAK S Y,JIN J H,et al.Thermally resistant UV-curable epoxy-siloxane hybrid materials for light emitting diode(LED)encapsulation[J].Journal of Materials Chemistry,2012,22(18):8874-8880.
[26]QI Y,LI L,FANG Z,et al.Effects of small molecular weight silicon-containing acrylate on kinetics,morphologies,and properties of free-radical/cationic hybrid UV-cured coatings[J].Applied Polymer Science,2014,131(16):318-323.
基本信息:
DOI:10.13416/j.ca.2021.09.002
中图分类号:TQ323.5
引用信息:
[1]李坚辉,王树浩,宋彩雨,等.脂环族环氧与环氧基三甲氧基硅烷混合体系的阳离子光聚合研究[J].中国胶粘剂,2021,30(09):1-6+11.DOI:10.13416/j.ca.2021.09.002.
基金信息:
黑龙江省科学院青年基金杰青项目(CXJQ2019SH01)
2021-09-23
2021-09-23