Research progress of bio-based raw materials for polyurethane adhesive in the electronics industry
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系统地综述了生物基原料用于电子行业用聚氨酯胶的研究进展，包括单组分反应型聚氨酯热熔胶和双组分聚氨酯胶。首先，介绍了常见的单组分反应型聚氨酯热熔胶和双组分聚氨酯胶的反应机理，配方主要组分多元醇、异氰酸酯及相应助剂的生物基研究进展；再详细阐述了生物基原料，如蓖麻油、大豆油、菜籽油、棕榈油、桐油等生物基多元醇以及生物基异氰酸酯和非异氰酸酯，作为聚氨酯胶原材料的应用潜力；然后对生物基原料对电子行业用单组分反应型聚氨酯热熔胶和双组分聚氨酯胶的性能表现进行了全面分析，如粘接强度、耐热性、耐湿性、绝缘性等关键性能指标；最后，对生物基原料用于电子行业用聚氨酯胶的未来发展趋势进行了展望，指出未来的研究方向将集中在提高性能、降低成本、拓展应用领域以及加强产业化发展等方面，为生物基聚氨酯胶在电子行业的广泛应用提供理论支持和技术参考。
Abstract：A systematic review was conducted on the research progress of bio-based materials for polyurethane adhesive used in the electronics industry,including single component reactive polyurethane hot melt adhesive and two-component polyurethane adhesive.Firstly,the reaction mechanisms of common single component reactive polyurethane hot melt adhesive and two-component polyurethane adhesive,as well as the bio-based research progress of the main components of the formula,i.e. polyols,isocyanates,and corresponding additives were introduced.The application potential of bio-based raw materials,such as castor oil,soybean oil,rapeseed oil,palm oil,tung oil,and other bio-based polyols,as well as bio-based isocyanates and non isocyanates,as polyurethane adhesive materials were further elaborated.Then,a comprehensive analysis was conducted on the performance of bio-based raw materials on single component reactive polyurethane hot melt adhesive and two-component polyurethane adhesive used in the electronics industry,including key performance indicators such as bonding strength,heat resistance,moisture resistance,and insulation.Finally,the future development trend of using biobased raw materials for polyurethane adhesive in the electronics industry was discussed,and it was pointed out that future research directions would focus on improving performance,reducing costs,expanding application areas,and strengthening industrial development,which provide theoretical support and technical references for the widespread application of bio-based polyurethane adhesive in the electronics industry.
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基本信息:
DOI：10.13416/j.ca.2025.04.003
中图分类号:TQ433.432
引用信息:
[1]徐玉文,刘良军.生物基原料用于电子行业用聚氨酯胶的研究进展[J].中国胶粘剂,2025,34(04):11-17.DOI:10.13416/j.ca.2025.04.003.
Citation Information:
[1]Xu Yuwen,Liu Liangjun.Research progress of bio-based raw materials for polyurethane adhesive in the electronics industry[J].中国胶粘剂,2025,34(04):11-17.DOI:10.13416/j.ca.2025.04.003.
2025-04-30
2025-04-30