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采用间二乙炔基苯(PAA)改性硅炔杂化树脂(PSA),制备了适用于RTM成型工艺的耐高温聚合物(H树脂)。通过差示扫描量热(DSC)法、流变分析、傅里叶变换红外光谱(FT-IR)法探索H树脂的固化行为。研究结果表明:随着PAA含量增加,H树脂的DSC固化峰值温度从235℃降到208℃;H-0、H-2、H-3和H-4的凝胶温度分别为194、162、136和132℃;采用Kissinger法和Ozawa法计算得到H-2树脂固化的表观活化能分别为122.7和124.6 kJ/mol,属于一级固化反应;玻璃纤维增强H-2树脂复合材料的常温弯曲强度为208 MPa,经700℃热处理7 min后常温弯曲强度为105 MPa。
Abstract：The high temperature resistant polymer(H resin)for RTM molding process was prepared by using m-diethylnylbenzene(PAA)to modify silicone alkyne hybrid resin(PSA). The curing behavior of H resin was studied by differential scanning calorimetry(DSC),rheological analysis and Fourier transform infrared spectroscopy(FT-IR).The research results showed that with the increase of PAA content,the DSC curing peak temperature of H resin decreased from 235 to 208 ℃. The gelation temperatures of H-0,H-2,H-3 and H-4 were 194,162,136 and132 ℃,respectively. The apparent activation energy of H-2 resin was 122.7 and 124.6 kJ/mol,respectively,which were calculated by Kissinger method and Ozawa method,and they belonged to the first-order curing reaction. The bending strength of the glass fiber reinforced H-2 resin composite was 208 MPa at room temperature,and it was105 MPa at room temperature after heat treatment for 7 min at 700 ℃.
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基本信息:
DOI：10.13416/j.ca.2020.06.002
中图分类号:TQ320.1
引用信息:
[1]轩立新,王茂源,束长朋等.RTM成型工艺用改性硅炔杂化树脂性能研究[J].中国胶粘剂,2020,29(06):1-6.DOI:10.13416/j.ca.2020.06.002.
基金信息: