中国胶粘剂

本文研究并分析了银粉种类、固化剂种类和添加量以及促进剂种类等重要因素对导电银胶电学和力学性能的影响，评估并分析了导电银胶粘接不同界面的力学性能。最终确定以银粉负载量为80%，双氰胺类固化剂在树脂中添加量为8.3%，促进剂选用复合促进剂，制备了具有较长的室温适用期的单组分导电银胶。研究结果表明：导电银胶具有优异的电学和力学性能，体积电阻率低至1.11×10^-4〇·cm，粘接Si-Ag、Ni-Ni、Au-Au、Cu-Cu和Ag-Ag界面的芯片剪切强度分别为36.17、33.38、30.22、18.01和11.07 kgf，可与市售进口导电银胶性能相媲美。此外，研究发现可以通过微调导电银胶配方的方法，来改善不同材料界面粘接的力学性能。

The influence of important factors such as silver powder type,curing agent type and dosage,and accelerator type on the electrical and mechanical properties of conductive silver adhesive was studied and analyzed in this article,and the mechanical properties of conductive silver adhesive bonding at different interfaces were evaluated and analyzed. Finally,the one-component conductive silver adhesive with the long room temperature applicability period was prepared with the silver powder loading of 80%,the melamine curing agent added to the resin of 8.3%,and the composite promoter selected.The research results showed that,the conductive silver adhesive had excellent electrical and mechanical properties,with the volume resistivity as low as 1.11×10^-4 〇·cm.The chip shear strength for bonding Si-Ag,Ni-Ni,Au-Au,Cu-Cu,and Ag-Ag interfaces was 36.17,33.38,30.22,18.01,and 11.07 kgf,respectively,which was comparable to the performance of commercially available imported conductive silver adhesive. In addition,it has found that the mechanical properties of interface bonding between different materials could be improved by fine-tuning the conductive silver adhesive formula.