中国胶粘剂

以α-ω二羟基聚硅氧烷为基胶，以镀银铜粉为导电填料，以硅微粉、白炭黑和硬脂酸锌为体质填料，制备了具有良好粘接性能和电磁屏蔽性能的导电胶粘剂。考察了镀银铜粉的粒径、形貌、银含量及填充量对胶粘剂搭接剪切强度、导电性能、电磁屏蔽性能的影响。研究结果表明：镀银铜粉的银含量与填充量的增加明显提升了导电胶粘剂固化后的导电性能，随着银含量与填充量的增加，体积电阻率先降低、后趋于稳定；胶粘剂的剪切强度则是随着导电粉的粒径与填充量的增加而不断降低。试验中采用银含量为20%（质量分数）的45μm枝状铜导电粉在添加量为70.8%时，制得的导电胶粘剂的综合性能较佳，固化后体积电阻率达到0.007Ω·cm，剪切强度为1.05 MPa，电磁屏蔽性能≥85 dB(300 MHz～10 GHz)。

Conductive adhesive with good bonding properties and electromagnetic shielding performance was prepared with α-ω dihydroxy polysiloxane as the substrate adhesive,silver-plated copper powder as conductive filler,silicon micro powder,silica and zinc stearate as bulk filler.The effects of particle size,morphology,silver content and filling amount of silver-plated copper powder on lap shear strength,electrical conductivity and electromagnetic shielding performance of adhesive were investigated.The research results showed that the increase of silver content and filling amount of silver-plated copper powder significantly improved the conductivity of the cured conductive adhesive. With the increase of silver content and filling amount,the volume resistance first decreased and then stabilized.The shear strength of adhesive decreased with the increase of particle size and filling amount of conductive powder. In the experiment,when 45 μm dendritic conductive powder with 20% silver content(mass fraction) was used and the adding amount was 70.8%,the comprehensive performance of the conductive adhesive prepared was relatively good,the volume resistivity after curing reached 0.007 Ω·cm,the shear strength was 1.05 MPa,and the electromagnetic shielding performance was more than 85 dB(300 MHz-10 GHz).