中国胶粘剂

在α,ω-二羟基聚硅氧烷中添加膨润土和镀银铜粉,制备了有机硅导电黏合剂。着重考察了膨润土填充量对导电黏合剂搭接剪切强度、剥离强度、导电性能及硬度的影响。研究结果表明:随着膨润土填充量的增加,能够显著增加导电黏合剂固化后的导电性能,电阻率先降低后趋于稳定;黏合剂的硬度则随膨润土填充量的增加逐渐增大,搭接剪切强度、剥离强度则是先增大后逐渐降低。当w(膨润土)=10%(相对于黏合剂总质量而言)时,导电黏合剂体积电阻率小于0.01Ω·cm,邵氏硬度为63A,剥离强度为1.00 N/mm,搭接剪切强度为0.84 MPa。

The silicone conductive adhesive was prepared by adding bentonite and silver-plated copperpowder to α,ω-dihydroxypolysiloxane. The effects of filling amount of bentonite on the lap shear strength,peelingstrength,electrical conductivity and hardness of conductive adhesive were emphatically investigated. The researchresults showed that with the increase of filling amount of bentonite,the electrical conductivity of conductiveadhesive could be significantly increased,while the resistance decreased first and then tended to be stable. Thehardness of adhesive increased with the increasing of bentonite filling,while the lap shear strength and peelingstrength increased first and then decreased gradually. When w(bentonite)=10%(relative to the total mass of theadhesive),the volume resistivity of conductive adhesive was less than 0.01 Ω·cm,the Shore hardness was 63 A,thepeeling strength was 1.00 N/mm,and the lap shear strength was 0.84 MPa.